Bifunctional (meth)acrylate compound and polymer
US-11814351-B2 · Nov 14, 2023 · US
Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds (G03F7/075 takes precedence)
Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds (G03F7/075 takes precedence) · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G03F7/025 |
| Official title | Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds (G03F7/075 takes precedence) |
| Display label | Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds (G03F7/075 takes precedence) |
| Total patents | 89 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2017 | 3 |
| 2018 | 6 |
| 2019 | 10 |
| 2020 | 15 |
| 2021 | 13 |
| 2022 | 10 |
| 2023 | 11 |
| 2024 | 9 |
| 2025 | 9 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Photoactive compounds, photoresist compositions including the same, and pattern formation methods
US-2023314934-A1 · Oct 5, 2023 · US
Epoxy compound, resist composition, and pattern forming process
US-11492337-B2 · Nov 8, 2022 · US
Photocurable compositions for stereolithography, method of forming the compositions, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components
US-2022298270-A1 · Sep 22, 2022 · US
Photosensitive composition for hologram recording, hologram recording medium, and hologram
US-11427656-B2 · Aug 30, 2022 · US
Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film
US-2022269175-A1 · Aug 25, 2022 · US
Photocurable compositions for stereolithography, method of forming the compositions, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components
US-11401353-B2 · Aug 2, 2022 · US
Method for manufacturing cured film and use of the same
US-2022221794-A1 · Jul 14, 2022 · US
Multi-level substrate coating film-forming composition containing plasma-curable compound based on unsaturated bonds between carbon atoms
US-11385546-B2 · Jul 12, 2022 · US
Composition for forming silicon-containing resist underlayer film and patterning process
US-2022179317-A1 · Jun 9, 2022 · US
Compound, composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process
US-11307497-B2 · Apr 19, 2022 · US
Method for preparing holographic pattern-expressing organogel using dithering mask
US-2022004147-A1 · Jan 6, 2022 · US
Click-chemistry compatible structures, click-chemistry functionalized structures, and materials and methods for making the same
US-2021364915-A1 · Nov 25, 2021 · US
Coating compositions and methods of forming electronic devices
US-2021343522-A1 · Nov 4, 2021 · US
Coating compositions and methods of forming electronic devices
US-2021341840-A1 · Nov 4, 2021 · US
Compound, composition containing the same, method for forming resist pattern and method for forming insulating film
US-2021331994-A1 · Oct 28, 2021 · US
Water-soluble diacetylene, photolithography composition comprising water-soluble diacetylene monomer and conductive polymer, and fine pattern preparation method using same
US-11131925-B2 · Sep 28, 2021 · US
Click-chemistry compatible structures, click-chemistry functionalized structures, and materials and methods for making the same
US-11106131-B2 · Aug 31, 2021 · US
Resist composition and method of forming resist pattern
US-2021191262-A1 · Jun 24, 2021 · US
Compound and composition for forming organic film
US-11022882-B2 · Jun 1, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC G03F7/025?
- CPC G03F7/025 is the Cooperative Patent Classification code for “Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds (G03F7/075 takes precedence).”
- How many patents are filed under CPC G03F7/025 (Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds (G03F7/075 takes precedence))?
- Our database includes 89 publications tagged with this CPC code.
- Is patent activity under CPC G03F7/025 growing?
- Publication counts under this code: 9 in 2024 vs 9 in 2025 (latest complete years).