Method for determining minimum number of samples required for obtaining dielectric breakdown strength and electronic device and computer-readable storage medium implementing said method
US-2026086136-A1 · Mar 26, 2026 · US
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Subjecting similar articles in turn to test, e.g. go/no-go tests in mass production
Subjecting similar articles in turn to test, e.g. go/no-go tests in mass production · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G01R31/18 |
| Official title | Subjecting similar articles in turn to test, e.g. go/no-go tests in mass production |
| Display label | Subjecting similar articles in turn to test, e.g. go/no-go tests in mass production |
| Total patents | 20 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 2 |
| 2018 | 3 |
| 2019 | 1 |
| 2020 | 4 |
| 2021 | 2 |
| 2024 | 2 |
| 2025 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Time-dependent dielectric breakdown (tddb) test unit circuit, measurement circuit, and method thereof
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Methods and systems for component analysis, sorting, and sequencing based on component parameters and devices utilizing the methods and systems
US-2024282645-A1 · Aug 22, 2024 · US
Methods and systems for component analysis, sorting, and sequencing based on component parameters and devices utilizing the methods and systems
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Method of manufacturing a semiconductor device
US-11043434-B2 · Jun 22, 2021 · US
Apparatuses and methods involving adjustable circuit-stress test conditions for stressing regional circuits
US-10901023-B2 · Jan 26, 2021 · US
Testing solid state devices before completing manufacture
US-10784172-B2 · Sep 22, 2020 · US
Method of manufacturing a semiconductor device
US-2020152529-A1 · May 14, 2020 · US
Method of manufacturing a semiconductor device and semiconductor device
US-10580708-B2 · Mar 3, 2020 · US
Apparatuses and methods involving adjustable circuit-stress test conditions for stressing regional circuits
US-2020049756-A1 · Feb 13, 2020 · US
Testing solid state devices before completing manufacture
US-2019206746-A1 · Jul 4, 2019 · US
Method of manufacturing a semiconductor device and semiconductor device
US-2018240721-A1 · Aug 23, 2018 · US
Triaxial DC-AC connection system
US-9983228-B2 · May 29, 2018 · US
Kernel based cluster fault analysis
US-9891267-B2 · Feb 13, 2018 · US
Kernel based cluster fault analysis
US-2017356955-A1 · Dec 14, 2017 · US
Methods and devices for battery protection
US-9660301-B2 · May 23, 2017 · US
Dielectric strength voltage testing method for electronics device
US-9404958-B2 · Aug 2, 2016 · US
Triaxial dc-ac connection system
US-2016084878-A1 · Mar 24, 2016 · US
System for testing semiconductor modules
US-9134365-B2 · Sep 15, 2015 · US
Methods and devices for battery protection
US-2015118525-A1 · Apr 30, 2015 · US