Batch furnace assembly and method of operating a batch furnace assembly
US-2022412652-A1 · Dec 29, 2022 · US
Charging; Manipulation of SC or SC wafers
Charging; Manipulation of SC or SC wafers · Cooperative Patent Classification (CPC)
Engines, pumps, lighting, heating, and mechanical systems.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | F27D3/0084 |
| Official title | {Charging; Manipulation of SC or SC wafers} |
| Display label | Charging; Manipulation of SC or SC wafers |
| Total patents | 95 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 9 |
| 2017 | 2 |
| 2018 | 3 |
| 2019 | 5 |
| 2020 | 12 |
| 2021 | 14 |
| 2022 | 11 |
| 2023 | 11 |
| 2024 | 12 |
| 2025 | 9 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Vertical batch furnace assembly comprising a cooling gas supply
US-11530876-B2 · Dec 20, 2022 · US
Wafer boat handling device, vertical batch furnace and method
US-11515188-B2 · Nov 29, 2022 · US
Heater lift assembly spring damper
US-2022319880-A1 · Oct 6, 2022 · US
Substrate processing apparatus
US-2022230897-A1 · Jul 21, 2022 · US
Heat treatment apparatus and heat treatment method
US-11393702-B2 · Jul 19, 2022 · US
Door opener and substrate processing apparatus provided therewith
US-11378337-B2 · Jul 5, 2022 · US
Heater lift assembly spring damper
US-11367632-B2 · Jun 21, 2022 · US
Substrate processing apparatus and purging method
US-11367642-B2 · Jun 21, 2022 · US
Processing apparatus
US-11302542-B2 · Apr 12, 2022 · US
Substrate treating equipment
US-2022084847-A1 · Mar 17, 2022 · US
Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
US-2021358777-A1 · Nov 18, 2021 · US
Heater lift assembly spring damper
US-2021351048-A1 · Nov 11, 2021 · US
Vertical batch furnace assembly comprising a cooling gas supply
US-2021333049-A1 · Oct 28, 2021 · US
Injector configured for arrangement within a reactor of a vertical furnace and vertical furnace
US-2021324518-A1 · Oct 21, 2021 · US
Substrate processing apparatus for processing substrates
US-2021320020-A1 · Oct 14, 2021 · US
Substrate processing apparatus and method
US-2021272821-A1 · Sep 2, 2021 · US
Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
US-11107709-B2 · Aug 31, 2021 · US
Substrate processing apparatus for processing substrates
US-11087997-B2 · Aug 10, 2021 · US
Substrate processing apparatus and method
US-11024523-B2 · Jun 1, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC F27D3/0084?
- CPC F27D3/0084 is the Cooperative Patent Classification code for “Charging; Manipulation of SC or SC wafers.”
- How many patents are filed under CPC F27D3/0084 (Charging; Manipulation of SC or SC wafers)?
- Our database includes 95 publications tagged with this CPC code.
- Is patent activity under CPC F27D3/0084 growing?
- Publication counts under this code: 12 in 2024 vs 9 in 2025 (latest complete years).