Wafer boat handling device, vertical batch furnace and method

Patent metadata

Field	Value
Publication number	US-11515188-B2
Application number	US-202015930567-A
Country	US
Kind code	B2
Filing date	May 13, 2020
Priority date	May 16, 2019
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

Wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace, and comprising a rotatable table comprising a first and a second wafer boat support surface. Each wafer boat support surface is configured for supporting a wafer boat. The rotatable table is rotatable by an actuator to rotate both the first and the second wafer support surfaces to a load/receive position in which the wafer boat handling device is configured to load a wafer boat vertically from the rotatable table into the process chamber and to receive the wafer boat from the process chamber onto the rotatable table, a cooldown position in which the wafer boat handling device is configured to cool down a wafer boat, and a transfer position for transferring wafers to and/or from the wafer boat.

First claim

The invention claimed is:

1. A wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace, wherein the wafer boat handling device comprises:
a rotatable table having just a first and a second wafer boat support surface, each configured to support a wafer boat configured to accommodate a plurality of wafers, wherein the rotatable table is rotatable by an actuator around a central substantially vertical axis to rotate the first and the second wafer support surfaces to:
a load/receive position in which the wafer boat handling device is configured to load a wafer boat vertically from the rotatable table into the process chamber and to receive the wafer boat from the process chamber onto the rotatable table;
a cooldown position in which the wafer boat handling device is configured to cool down a wafer boat; and
a transfer position in which the wafer boat handling device is configured to allow transfer of wafers to and/or from the wafer boat; and
wherein a rotational angle of the rotatable table to rotate the wafer boat support surface from the cooldown position to the transfer position is enough to prevent heat transfer from a wafer boat which is in the cooldown position to a part of a circumferential wall of the wafer boat handling device adjacent to the transfer position to an extent as to keep the temperature of the part of the circumferential wall adjacent to the transfer position below 70° C., or below 50° C.

2. The wafer boat handling device according to claim 1 , wherein the wafer boat handling device is configured such that the second wafer boat support surface of the rotatable table is rotatable by the actuator from the cooldown position to the transfer position when a wafer boat from the first wafer boat support surface has been loaded into the process chamber.

3. The wafer boat handling device according to claim 1 , wherein a rotational angle of the rotatable table to rotate the wafer boat support surface from the cooldown position to the transfer position is between 1° and 80°, or between 40° and 50°, or 45°.

4. The wafer boat handling device according to claim 1 , wherein the wafer boat handling device is configured such that the second wafer boat support surface is in the cooldown position when the first wafer boat support surface is in the load/receive position.

5. The wafer boat handling device according to claim 4 , wherein the wafer handling device is configured with the rotational table and the wafer boat support surface being rotatable from the load/receive position to the cooldown position over a rotational angle between 120° and 240°, between 170° and 190°, or 180°.

6. The wafer boat handling device according to claim 1 , wherein the wafer boat handling device is configured to subsequently:
load a first wafer boat vertically from the first wafer boat support surface which is in the load/receive position into the process chamber;
cool down a second wafer boat on the second wafer boat support surface which is in the cooldown position;
rotate the rotatable table to a rotational position in which the second wafer boat support surface is in the transfer position;
transfer wafers to and/or from the second wafer boat;
rotate the rotatable table to a rotational position in which the first wafer boat support surface is in the load/receive position;
receive the first wafer boat from the process chamber on the first wafer boat support surface; and
rotate the rotatable table to a rotational position in which the second wafer boat support surface is in the load/receive position.

7. A vertical batch furnace assembly comprising:
a process chamber for processing wafers accommodated in a wafer boat;
a wafer boat handling device according to claim 1 , wherein the wafer boat handling device is positioned under the process chamber.

8. The vertical batch furnace assembly according to claim 7 , provided with a substantially rectangular footprint having two opposite short sides defining a width of the vertical batch furnace assembly and having two opposite long sides defining a length of the vertical batch furnace assembly, wherein the vertical batch furnace assembly further comprises:
at least one cassette in-out port arranged at one of the short sides of the vertical batch furnace assembly;
a cassette storage configured to store a plurality of substrate cassettes each of which comprises wafers;
a cassette door opener device;
a cassette handler configured to transfer substrate cassettes between the cassette in-out port, the cassette storage and the door opener device;
a wafer handler configured to transfer wafers between a cassette in the door opener device and a boat in the wafer boat handling device, wherein the width of the vertical batch furnace assembly is 1.1 meter or less.

9. A method for handling wafer boats comprising:
providing a vertical batch furnace assembly comprising a process chamber and a wafer boat handling device which is positioned under the process chamber, wherein the wafer boat handling device is the wafer boat handling device according to claim 1 ;
providing the first wafer boat support surface with an associated first wafer boat loaded with wafers and the second wafer boat support surface with an associated second wafer boat loaded with wafers;
loading the first wafer boat vertically from the first wafer boat support surface which is in the load/receive position into the process chamber; and
processing the wafers accommodated in the first wafer boat in the process chamber, whilst simultaneously:
cooling down the second wafer boat on the second wafer boat support surface which is in the cooldown position;
subsequent to the cooling down, rotate the rotatable table to a position in which the second wafer boat support surface is in the transfer position;
transferring wafers to and/or from the second wafer boat; and
subsequent to the transferring, rotate the rotatable table to a position in which the first wafer boat support surface is in the load/receive position.

10. The method according to claim 9 , further comprising
receiving the first wafer boat from the process chamber on the first wafer boat support surface; and
subsequently rotate the rotatable table to a rotational position in which the second wafer boat support surface is in the load/receive position.

11. A wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace, wherein the wafer boat handling device comprises:
a rotatable table having just a first and a second wafer boat support surface, each configured to support a wafer boat configured to accommodate a plurality of wafers, wherein the rotatable table is rotatable by an actuator around a central substantially vertical axis to rotate the first and the second wafer support surfaces to:
a load/receive position in which the wafer boat handling device is configured to load a wafer boat vertically from the rotatable table into the process chamber and to receive the wafer boat from the process chamber onto the rotatable table;
a cooldown position in which the wafer boat handling device is configured to cool down a wafer boat; and
a transfer position in which the wafer boat handling device is configured to allow transfer of wafers to and/or from the wafer boat;
the wafer boat handling device further comprising a main housing having a circumferential wall which is provided with a transfer opening at the transfer position through which wafers can be transferred to and from the wafer boat that is accommodated on the wafer boat support surface which is in the transfer position.

12. The wafer boat handling device accor

Assignees

• Asm Ip Holding Bv

Inventors

• De Ridder Christianus G M
• Oosterlaken Theodorus G M

Classifications

• H10P72/127

  characterised by the substrate support · CPC title

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3406

  involving removal of lid, door or cover · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title