Edgeless pulse plating and metal cleaning methods for solar cells

Patent metadata

Field	Value
Publication number	US-9328427-B2
Application number	US-201213630546-A
Country	US
Kind code	B2
Filing date	Sep 28, 2012
Priority date	Sep 28, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A method for plating metal to a solar cell is disclosed. The method includes plating a metal layer only on the surface of solar cell without plating metal along the solar cell edges by conducting a first current in a first direction in an electroplating bath, ejecting metal from the metal layer by conducting a second current in a second direction and plating additional metal to the metal layer by conducting a third current in the first direction. The first, second and third current can be alternated. Subsequent to an electroplating process, an ultrasonic cleaning process is performed on the solar cell to remove any excess plated metal along the surface and edges of the solar cell.

First claim

What is claimed is:

1. A method of plating a metal layer on a solar cell, the solar cell having a front side configured to face the sun during normal operation, a back side opposite the front side, and four side edges, the method comprising:
plating a first metal layer on a solar cell, wherein the solar cell comprises a seed metal layer on a silicon substrate, wherein plating a first metal layer comprises conducting a first current through a seed metal layer of the solar cell using a metal electrode in an electroplating bath, wherein the first current is conducted in a first direction, at a first voltage and for a first time;
ejecting metal from the first metal layer by conducting a second current through the solar cell in a second direction, at a second voltage and at a second time; and
subsequent to the ejecting metal from the first metal layer, plating additional metal to the first metal layer by conducting a third current at a third voltage for a third time in the first direction.

2. The method of claim 1 wherein the ejecting metal from the first metal layer further comprises disproportionately removing metal from at least one of the four side edges of the solar cell compared to metal removed from the back side of the solar cell.

3. The method of claim 1 wherein the ejecting metal from the first metal layer further comprises disproportionally removing metal from at least one of the four side edges of the solar cell compared to metal removed from the back side of the solar cell without removing metal from the seed metal layer.

4. The method of claim 1 wherein the plating and the ejecting operations are alternated throughout the plating process.

5. The method of claim 1 , wherein the second time is shorter than the first time.

6. The method of claim 1 , wherein the second voltage is at most 3 times greater than that of the first voltage.

7. The method of claim 1 , wherein the step of plating the first metal layer further comprises plating the first metal layer on at least one of the four side edges of the solar cell with a thickness of less than approximately 1 micrometer.

8. The method of claim 1 further comprising:
preparing the electroplating bath comprising an electrolyte solution with a portion of a first metal interconnect and a second metal interconnect submersed within the electroplating bath and another portion of the first metal interconnect and the second metal interconnect coupled to a rectifier;
connecting the metal electrode to the first metal interconnect; connecting the solar cell to the second metal interconnect to provide for the plating of the first metal layer on the solar cell;
subsequent to the step of plating additional metal to the first metal layer, disconnecting the metal electrode from the first metal interconnect; connecting a second meta electrode to the first metal interconnect; and plating a second metal layer on the solar cell, wherein the solar cell comprises the first metal layer on the seed metal layer, wherein plating the second metal layer comprises conducting a fourth current through the first metal layer of the solar cell, wherein the fourth current is conducted in the first direction, at a fourth voltage and for a fourth time;
ejecting metal from the second metal layer by conducting a fifth current through the solar cell in the second direction, at a fifth voltage and at a fifth time; and, subsequent to the ejecting metal from the second metal layer,
plating additional metal to the second metal layer by conducting a sixth current at a sixth voltage for a sixth time in the first direction.

9. The method of claim 8 , wherein the plating the first and second metal layer comprises plating a first and second metal selected from the group containing copper, tin, aluminum, silver, gold, chromium, iron, nickel, zinc, ruthenium, palladium, and platinum.

10. A method of plating a metal layer on a solar cell, the solar cell having a front side configured to face the sun during normal operation, a back side opposite the front side, and four side edges, the method comprising:
depositing a seed metal layer on a silicon substrate of the solar cell;
plating a first metal layer on the solar cell, wherein the plating of the first metal layer comprises conducting an electric current through the seed metal layer of the solar cell; and
performing an ultrasonic cleaning process to remove excess plated metal from at least one of the four side edges of the solar cell resulting from the step of plating the first metal layer on the solar cell.

11. The method of claim 10 , wherein the plating the metal layer on the solar cell further comprises:
plating a second metal layer on the solar cell, wherein the plating the second metal layer comprises conducting an electric current through the first metal layer of the solar cell.

12. The method of claim 10 , wherein the depositing the seed metal layer on the silicon substrate of the solar cell comprises depositing the seed metal layer through a physical vapor deposition (PVD) process.

13. The method of claim 10 , wherein the depositing the seed metal layer on the silicon substrate of the solar cell comprises depositing the seed metal layer through a pattern-print deposition process.

14. The method of claim 10 , wherein the depositing the seed metal layer comprises depositing a metal selected from the group containing copper, tin, tungsten, titanium, titanium tungsten, silver, gold, titanium nitride, tantalum nitride, ruthenium and platinum.

15. The method of claim 10 , wherein the performing an ultrasonic cleaning process comprises:
submersing the solar cell within an ultrasonic medium; and
vibrating the ultrasonic medium using an ultrasonic generator to remove the excess plated metals adhering to at least one of the four side edges of the solar cell.

16. The method of claim 15 , wherein the ultrasonic medium comprises a medium selected from the group consisting of water, air, surfactant solutions, ionic solutions, acids and bases.

17. The method of claim 15 , wherein the vibrating the ultrasonic medium comprises vibrating the ultrasonic medium within a frequency range of 20 to 400 kilohertz.

18. The method of claim 10 , wherein the plating the first metal layer on the solar cell further comprises:
the plating of the first metal layer on the solar cell by conducting a first current through the seed metal layer of the solar cell using a metal electrode in an electroplating bath, wherein the first current is conducted in a first direction, at a first voltage and for a first time;
ejecting metal from the first metal layer by conducting a second current through the solar cell in a second direction, at a second voltage and at a second time; and
subsequent to the ejecting metal from the first metal layer, plating additional metal to the first metal layer by conducting a third current at a third voltage for a third time in the first direction.

19. A method of plating a metal layer on a solar cell, the solar cell having a front side configured to face the sun during normal operation, a back side opposite the front side, and four side edges, the method comprising:
depositing a seed metal layer on a silicon substrate of the solar cell;
preparing an electroplating bath comprising an electrolyte solution with a portion of a first metal interconnect and a second metal interconnect submersed within the electroplating bath and another portion of the first metal interconnect and second metal interconnect coupled to a rectifier;
connecting a first metal electrode to the first m

Assignees

• Behnke Joseph
• Sunpower Corp

Inventors

• Behnke Joseph

Classifications

• C25D5/48 Primary

  After-treatment of electroplated surfaces · CPC title

• H10F77/219 Primary

  Arrangements for electrodes of back-contact photovoltaic cells · CPC title

• C25D7/126

  for solar cells · CPC title

• H01L31/022441

  Electricity · mapped topic

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title