Manufacturing method for substrate having conductive pattern, manufacturing method for electronic device, substrate having conductive pattern, and protective film for metal nanobody

Patent metadata

Field	Value
Publication number	US-2022400553-A1
Application number	US-202217751817-A
Country	US
Kind code	A1
Filing date	May 24, 2022
Priority date	May 31, 2021
Publication date	Dec 15, 2022
Grant date	—

Abstract

There are provided a manufacturing method for a substrate having a conductive pattern, a manufacturing method for an electronic device, and a substrate having a conductive pattern, which are excellent in the dimensional stability of the conductive pattern after applying an electric current, as well as a protective film for a metal nanobody.Provided are the manufacturing method for a substrate having a conductive pattern, comprising a step 1a of forming a conductive layer a containing a metal nanobody and a resin 1 on a substrate; a step 1b of forming a resin layer b containing a resin 2 on the conductive layer a; a step 2a of forming a photosensitive resin layer c on the resin layer b; a step 3 of obtaining a resin pattern c′ of the photosensitive resin layer by exposure and development treatment on the photosensitive resin layer c; a step 4 of removing the metal nanobody in the conductive layer a by etching to form a conductive pattern d; and a step 5a of softening or swelling at least one of the resin 1 or the resin 2, the manufacturing method for an electronic device, the substrate having a conductive pattern, and the protective film for a metal nanobody.

First claim

What is claimed is:

1 . A manufacturing method for a substrate having a conductive pattern, comprising:
a step 1 a of forming a conductive layer a containing a metal nanobody and a resin 1 on a substrate; a step 1 b of forming a resin layer b containing a resin 2 on the conductive layer a; a step 2 a of forming a photosensitive resin layer c on the resin layer b; a step 3 of obtaining a resin pattern c′ of the photosensitive resin layer by exposure and development treatment on the photosensitive resin layer c; a step 4 of removing the metal nanobody in the conductive layer a by etching to form a conductive pattern d; and a step 5 a of softening or swelling at least one of the resin 1 or the resin 2 .

2 . A manufacturing method for a substrate having a conductive pattern, comprising:
a step 1 a of forming a conductive layer a containing a metal nanobody and a resin 1 on a substrate; a step 2 b of forming a photosensitive resin layer c on the conductive layer a; a step 3 of obtaining a resin pattern c′ of the photosensitive resin layer by exposure and development treatment on the photosensitive resin layer c; a step 4 of removing the metal nanobody in the conductive layer a by etching to form a conductive pattern d; and a step 5 b of softening or swelling the resin 1 .

3 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein at least one surface of the obtained substrate having a conductive pattern has a first compartment in which the conductive pattern d is formed and a second compartment in which the conductive pattern d is not formed, and in a case where the second compartment is observed in a thickness direction of the substrate with a scanning electron microscope, an area where voids are observed is 10% or less with respect to a total area of the second compartment.

4 . The manufacturing method for a substrate having a conductive pattern according to claim 3 ,
wherein in the case where the second compartment is observed in a thickness direction of the substrate with the scanning electron microscope, the area where voids are observed is 8% or less with respect to the total area of the second compartment.

5 . The manufacturing method for a substrate having a conductive pattern according to claim 4 ,
wherein in a case where the second compartment is observed in the thickness direction of the substrate with the scanning electron microscope, the area where voids are observed is 5% or less with respect to the total area of the second compartment.

6 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein the conductive layer a has a light transmittance of 70% or more with respect to light having a wavelength of 380 nm to 780 nm.

7 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein the metal nanobody is a metal nanowire.

8 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein the metal nanobody is a nanoparticle having an aspect ratio of 1:1 to 1:10 and a sphere equivalent diameter of 1 nm to 200 nm.

9 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein the metal nanobody is a silver nanobody or a silver compound nanobody.

10 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein a conductive pattern d′ is further formed on a surface of the substrate opposite to a surface on which the conductive layer a is provided.

11 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein the resin layer b has a compound e that can be bonded or coordinated to a metal contained in the metal nanobody.

12 . The manufacturing method for a substrate having a conductive pattern according to claim 11 ,
wherein the compound e is a compound having an unshared electron pair.

13 . The manufacturing method for a substrate having a conductive pattern according to claim 12 ,
wherein the compound e is at least one compound selected from the group consisting of a nitrogen-containing compound having an unshared electron pair and a sulfur-containing compound having an unshared electron pair.

14 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein the photosensitive resin layer c contains an alkali-soluble resin, a polymerizable compound, and a photopolymerization initiator.

15 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein the step 5 a is a step of softening at least one of the resin 1 or the resin 2 by a heating treatment and filling, by the etching, voids generated by removing the metal nanobody.

16 . The manufacturing method for a substrate having a conductive pattern according to claim 15 ,
wherein the heating treatment in the step 5 a is carried out at a heating temperature that satisfies Tgp <Th<Tgb, where Th indicates a maximum temperature (° C.) during the heating treatment in the step 5 a , Tgp indicates a lower glass transition temperature (° C.) between a glass transition temperature of the resin 1 and a glass transition temperature of the resin 2 , and Tgb indicates a glass transition temperature (° C.) of the substrate.

17 . The manufacturing method for a substrate having a conductive pattern according to claim 2 ,
wherein the step 5 b is a step of softening the resin 1 by a heating treatment and filling, by the etching, voids generated by removing the metal nanobody.

18 . The manufacturing method for a substrate having a conductive pattern according to claim 1 ,
wherein the step 5 a is a step of swelling at least one of the resin 1 or the resin 2 and filling, by the etching, voids generated by removing the metal nanobody, during the step 4 or after the step 4 .

19 . The manufacturing method for a substrate having a conductive pattern according to claim 2 ,
wherein the step 5 b is a step of swelling the resin 1 and filling, by the etching, voids generated by removing the metal nanobody, during the step 4 or after the step 4 .

20 . A manufacturing method for an electronic device, wherein the electronic device includes a substrate having a conductive pattern, the substrate being obtained by the manufacturing method for a substrate having a conductive pattern according to claim 1 .

Assignees

• Fujifilm Corp

Inventors

• Katayama Akio
• Sato Morimasa

Classifications

• G03F7/033

  the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers · CPC title

• G03F7/032

  with binders · CPC title

• G03F7/027 Primary

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title

• H05K3/06 Primary

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title