Method for etching semiconductor structures and etching composition for use in such a method

Patent metadata

Field	Value
Publication number	US-9287228-B2
Application number	US-201414316558-A
Country	US
Kind code	B2
Filing date	Jun 26, 2014
Priority date	Jun 26, 2014
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

A method of etching a semiconductor structure, comprises contacting an under bump metallization (UBM) with an etching composition. The UBM includes an underlying layer comprising titanium and an overlying layer comprising a second metal. The etching composition is a liquid comprising at least 0.1 wt % hydrofluoric acid and at least 0.1 wt % phosphoric acid.

First claim

What is claimed is:

1. A method of etching a semiconductor structure, comprising:
contacting an under bump metallization (UBM) with an etching composition;
wherein the UBM includes an underlying layer comprising titanium and an overlying layer comprising a second metal; and
wherein the etching composition is a liquid comprising at least 0.1 wt % hydrofluoric acid and at least 0.1 wt % phosphoric acid.

2. The method according to claim 1 , wherein the second metal is copper.

3. The method according to claim 1 , wherein said contacting is performed for a time sufficient to over etch the underlying layer by at least 100% after nominal removal of the underlying layer.

4. The method according to claim 1 , wherein the underlying layer is a composite material comprising aluminum sandwiched between top and bottom layers of titanium.

5. The method according to claim 1 , wherein the underlying layer overlies a contact pad of a semiconductor device.

6. The method according to claim 5 , wherein said contacting is performed until the contact pad is partially exposed by removal of at least a part of said underlying layer.

7. The method according to claim 5 , wherein the contact pad is formed in a semiconductor substrate.

8. The method according to claim 5 , wherein the contact pad is formed in an interlayer insulating film.

9. The method according to claim 5 , wherein the contact pad comprises aluminum.

10. The method according to claim 1 , wherein upon completion of said contacting an undercut of the underlying layer relative to the overlying layer is less than or equal to 0.5 μm.

11. The method according to claim 10 , wherein said undercut is less than or equal to 0.3 μm.

12. The method according to claim 1 , wherein the etching composition comprises from 0.5 wt % to 20 wt % hydrofluoric acid, from 0.5 wt % to 20 wt % phosphoric acid and at least 60 wt % deionized water.

13. The method according to claim 1 , wherein said contacting is performed at a temperature from 15° C. to 30° C.

14. The method according to claim 1 , wherein said contacting is performed at a temperature from 20° C. to 25° C.

Assignees

• Kraus Harald
• Schier Hebert
• Lam Res Ag

Inventors

• Kraus Harald
• Schier Hebert

Classifications

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/019

  of bond pads · CPC title