Selective deposition of metals, metal oxides, and dielectrics
US-10456808-B2 · Oct 29, 2019 · US
Deposition of only one other non-metal element
Deposition of only one other non-metal element · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C16/28 |
| Official title | Deposition of only one other non-metal element |
| Display label | Deposition of only one other non-metal element |
| Total patents | 150 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 8 |
| 2017 | 6 |
| 2018 | 17 |
| 2019 | 20 |
| 2020 | 15 |
| 2021 | 15 |
| 2022 | 14 |
| 2023 | 14 |
| 2024 | 9 |
| 2025 | 17 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flourination process to create sacrificial oxy-flouride layer
US-10443125-B2 · Oct 15, 2019 · US
Boron-based film forming method and apparatus
US-2019301019-A1 · Oct 3, 2019 · US
Method and apparatus for forming silicon film, germanium film, or silicon germanium film
US-2019267236-A1 · Aug 29, 2019 · US
Film forming method, boron film, and film forming apparatus
US-10388524-B2 · Aug 20, 2019 · US
Method of Forming Boron-Based Film, and Film Forming Apparatus
US-2019244838-A1 · Aug 8, 2019 · US
Apparatus and methods for photo-excitation processes
US-10370762-B2 · Aug 6, 2019 · US
Selective film forming method and film forming apparatus
US-2019237326-A1 · Aug 1, 2019 · US
Method for marking and authenticating diamonds and precious stones
US-2019187063-A1 · Jun 20, 2019 · US
Method of filling recess and processing apparatus
US-2019172710-A1 · Jun 6, 2019 · US
Cobalt-containing compounds, their synthesis, and use in cobalt-containing film deposition
US-10309010-B2 · Jun 4, 2019 · US
Cleaning method and film forming method
US-2019144994-A1 · May 16, 2019 · US
Method of filling recess and processing apparatus
US-10269561-B2 · Apr 23, 2019 · US
Process for forming a film on a substrate using multi-port injection assemblies
US-10262859-B2 · Apr 16, 2019 · US
Cyclical deposition of germanium
US-2019027361-A1 · Jan 24, 2019 · US
Methods for forming a silicon germanium tin layer and related semiconductor device structures
US-2019013199-A1 · Jan 10, 2019 · US
Boron film removing method, and pattern forming method and apparatus using boron film
US-2018350598-A1 · Dec 6, 2018 · US
Metal oxy-flouride films for chamber components
US-2018327892-A1 · Nov 15, 2018 · US
Flourination process to create sacrificial oxy-flouride layer
US-2018327898-A1 · Nov 15, 2018 · US
Metal oxy-flouride films based on oxidation of metal flourides
US-2018327899-A1 · Nov 15, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C16/28?
- CPC C23C16/28 is the Cooperative Patent Classification code for “Deposition of only one other non-metal element.”
- How many patents are filed under CPC C23C16/28 (Deposition of only one other non-metal element)?
- Our database includes 150 publications tagged with this CPC code.
- Is patent activity under CPC C23C16/28 growing?
- Publication counts under this code: 9 in 2024 vs 17 in 2025 (latest complete years).