Foam Abrasive and Method for Producing Same
US-2022403130-A1 · Dec 22, 2022 · US
Non-aqueous liquid suspensions
Non-aqueous liquid suspensions · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09K3/1472 |
| Official title | {Non-aqueous liquid suspensions} |
| Display label | Non-aqueous liquid suspensions |
| Total patents | 80 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 11 |
| 2017 | 6 |
| 2018 | 8 |
| 2019 | 7 |
| 2020 | 8 |
| 2021 | 6 |
| 2022 | 10 |
| 2023 | 2 |
| 2024 | 4 |
| 2025 | 7 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Dispersant and polishing agent composition
US-2022290008-A1 · Sep 15, 2022 · US
Nanodiamond dispersion composition
US-2022259048-A1 · Aug 18, 2022 · US
Ceria-based composite fine particle dispersion, production method therefor, and polishing abrasive grain dispersion including ceria-based composite fine particle dispersion
US-11267715-B2 · Mar 8, 2022 · US
Azeotropic or azeotropic-like composition comprising hydrogen fluoride and 1,1,2-trifluoroethane, 1-chloro-2,2-difluoroethane, or 1,2-dichloro-1-fluoroethane
US-2022023693-A1 · Jan 27, 2022 · US
Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing
US-2021183688-A1 · Jun 17, 2021 · US
Liquid suspension of cerium oxide particles
US-11028288-B2 · Jun 8, 2021 · US
Polishing composition, polishing method, and method for manufacturing substrate
US-2021147714-A1 · May 20, 2021 · US
Cmp slurry compositions and methods of fabricating a semiconductor device using the same
US-2021130651-A1 · May 6, 2021 · US
Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
US-10968377-B2 · Apr 6, 2021 · US
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing
US-10937691-B2 · Mar 2, 2021 · US
Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the same
US-10829690-B2 · Nov 10, 2020 · US
Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
US-10792785-B2 · Oct 6, 2020 · US
Abrasive, abrasive set, and method for polishing substrate
US-10759968-B2 · Sep 1, 2020 · US
Organic film CMP slurry composition and polishing method using same
US-10723916-B2 · Jul 28, 2020 · US
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing
US-2020105580-A1 · Apr 2, 2020 · US
Ceria-Based Composite Fine Particle Dispersion, Production Method Therefor, and Polishing Abrasive Grain Dispersion Including Ceria-Based Composite Fine Particle Dispersion
US-2020087554-A1 · Mar 19, 2020 · US
Liquid suspension of cerium oxide particles
US-2020087539-A1 · Mar 19, 2020 · US
Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the same
US-2020071613-A1 · Mar 5, 2020 · US
Polishing slurry composition
US-2019367775-A1 · Dec 5, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C09K3/1472?
- CPC C09K3/1472 is the Cooperative Patent Classification code for “Non-aqueous liquid suspensions.”
- How many patents are filed under CPC C09K3/1472 (Non-aqueous liquid suspensions)?
- Our database includes 80 publications tagged with this CPC code.
- Is patent activity under CPC C09K3/1472 growing?
- Publication counts under this code: 4 in 2024 vs 7 in 2025 (latest complete years).