Chemical mechanical polish slurry and method of manufacture
US-2024395562-A1 · Nov 28, 2024 · US
on other substances
on other substances · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09G1/18 |
| Official title | on other substances |
| Display label | on other substances |
| Total patents | 67 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 5 |
| 2017 | 9 |
| 2018 | 4 |
| 2019 | 6 |
| 2020 | 8 |
| 2021 | 8 |
| 2022 | 7 |
| 2023 | 4 |
| 2024 | 2 |
| 2025 | 6 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Polishing composition, polishing method, and method of manufacturing semiconductor substrate
US-2024254366-A1 · Aug 1, 2024 · US
Surface treatment composition
US-2023313080-A1 · Oct 5, 2023 · US
Surface treatment composition, surface treatment method, and method for producing semiconductor substrate
US-2023313069-A1 · Oct 5, 2023 · US
Slurry composition for chemical mechanical polishing
US-2023104949-A1 · Apr 6, 2023 · US
CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-11560495-B2 · Jan 24, 2023 · US
Fluid composition and method for conducting a material removing operation
US-11518913-B2 · Dec 6, 2022 · US
Polishing solution, polishing apparatus, and polishing method
US-2022290009-A1 · Sep 15, 2022 · US
Polishing composition and polishing method
US-2022275246-A1 · Sep 1, 2022 · US
Polishing liquid and chemical mechanical polishing method
US-11401442-B2 · Aug 2, 2022 · US
CMP slurry solution for hardened fluid material
US-11312882-B2 · Apr 26, 2022 · US
Method of selective chemical mechanical polishing cobalt, zirconium oxide, poly-silicon and silicon dioxide films
US-11292938-B2 · Apr 5, 2022 · US
CMP slurry compositions and methods of fabricating a semiconductor device using the same
US-11279852-B2 · Mar 22, 2022 · US
Chemical Mechanical Polish Slurry and Method of Manufacture
US-2021313190-A1 · Oct 7, 2021 · US
Cmp slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-2021230451-A1 · Jul 29, 2021 · US
Chemical mechanical polish slurry and method of manufacture
US-11043396-B2 · Jun 22, 2021 · US
Polishing slurry and method of manufacturing semiconductor device
US-2021147713-A1 · May 20, 2021 · US
Cmp slurry compositions and methods of fabricating a semiconductor device using the same
US-2021130651-A1 · May 6, 2021 · US
Polishing slurry, method of manufacturing the same, and method of manufacturing semiconductor device
US-10961414-B2 · Mar 30, 2021 · US
Method of selective chemical mechanical polishing cobalt, zirconium oxide, poly-silicon and silicon dioxide films.
US-2021071034-A1 · Mar 11, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C09G1/18?
- CPC C09G1/18 is the Cooperative Patent Classification code for “on other substances.”
- How many patents are filed under CPC C09G1/18 (on other substances)?
- Our database includes 67 publications tagged with this CPC code.
- Is patent activity under CPC C09G1/18 growing?
- Publication counts under this code: 2 in 2024 vs 6 in 2025 (latest complete years).