CMP slurry compositions and methods of fabricating a semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-11279852-B2
Application number	US-202016912426-A
Country	US
Kind code	B2
Filing date	Jun 25, 2020
Priority date	Oct 30, 2019
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

Described herein are chemical mechanical polishing (CMP) slurry compositions, such as CMP slurry compositions for polishing an indium tin oxide (ITO) layer, along with methods of fabricating a semiconductor device using such a CMP slurry composition. The CMP slurry composition can include a polishing particle, a dispersing agent, an auxiliary oxidizing agent, and a sugar alcohol compound.

First claim

What is claimed is:

1. A chemical mechanical polishing (CMP) slurry composition for polishing an indium tin oxide (ITO) layer, the CMP slurry composition comprising:
a polishing particle;
a dispersing agent;
an auxiliary oxidizing agent; and
a sugar alcohol compound,
wherein the polishing particle is ceria that has a positively-charged surface and is in a colloidal state, and
wherein the dispersing agent is one or more selected from the group consisting of dipicolinic acid, dinicotinic acid, anthranilic acid, fusaric acid, and nitrobenzoic acid.

2. The CMP slurry composition of claim 1 , wherein the polishing particle is present in the composition in an amount from 0.1% to 10% by weight of the composition,
the dispersing agent is present in the composition in an amount from 0.01% to 25% by weight of the composition,
the auxiliary oxidizing agent is present in the composition in an amount from 0.001% to 2.5% by weight of the composition, and
the sugar alcohol compound is present in the composition in an amount from 0.1% to 20% by weight of the composition.

3. The CMP slurry composition of claim 1 , wherein the sugar alcohol compound is one or more selected from the group consisting of maltitol, lactitol, threitol, erythritol, ribitol, xylitol, arabitol, adonitol, sorbitol, talitol, mannitol, iditol, allodulcitol, dulcitol, galactitol, sedoheptitol, and perseitol.

4. The CMP slurry composition of claim 1 , wherein the CMP slurry composition has a pH from 2 to 7.

5. The CMP slurry composition of claim 1 , wherein the CMP slurry composition has a zeta potential from +5 mV to +70 mV.

6. The CMP slurry composition of claim 1 , wherein the auxiliary oxidizing agent is one or more selected from the group consisting of pimelic acid, malic acid, malonic acid, maleic acid, acetic acid, adipic acid, oxalic acid, succinic acid, tartaric acid, citric acid, lactic acid, glutaric acid, glycollic acid, formic acid, fumaric acid, propionic acid, butyric acid, hydroxybutyric acid, aspartic acid, itaconic acid, tricarballylic acid, suberic acid, sebacic acid, stearic acid, pyruvic acid, acetoacetic acid, glyoxylic acid, azelaic acid, caprylic acid, lauric acid, myristic acid, valeric acid, and palmitic acid.

7. The CMP slurry composition of claim 1 , wherein the CMP slurry composition polishes an indium tin oxide (ITO) layer at a polishing selectivity relative to a silicon oxide layer or a silicon nitride layer of 30:1 to 120:1 (polishing rate of the ITO layer (A/min):polishing rate of the silicon oxide or silicon nitride layer (A/min)).

8. The CMP slurry composition of claim 1 , further comprising water.

9. A method of fabricating a semiconductor device, comprising:
providing a substrate comprising a polishing stop layer on a lower layer;
etching the polishing stop layer and at least a portion of the lower layer to form a trench;
forming a transparent electrode layer on the polishing stop layer to fill the trench; and
performing a CMP process on the transparent electrode layer using the CMP slurry composition of claim 1 to expose the polishing stop layer and to form a first transparent electrode in the trench.

10. The method of claim 9 , further comprising, prior to providing the substrate, forming an optical filter on the substrate, and
forming the lower layer on the optical filter, and
wherein the trench does not expose the optical filter.

11. The method of claim 10 , further comprising, prior to forming the optical filter, forming a photoelectric conversion part in the substrate.

12. The method of claim 10 , wherein the substrate further comprises a pad region and a sensor region,
and the method further comprises forming the optical filter on the sensor region of the substrate, and, prior to forming the optical filter, forming a conductive pad on the pad region of the substrate,
wherein the lower layer and the polishing stop layer cover the conductive pad, and
the polishing stop layer is exposed on the pad region, after performing the CMP process.

13. The method of claim 9 , further comprising, prior to forming of the transparent electrode layer, forming a conductive plug in the lower layer,
wherein a top surface of the conductive plug is exposed through the trench.

14. The method of claim 9 , wherein the polishing stop layer is a silicon nitride layer.

15. The method of claim 9 , wherein the transparent electrode layer is an indium tin oxide (ITO) layer.

16. The method of claim 9 , further comprising:
forming an organic photoelectric conversion layer on the first transparent electrode; and
forming a second transparent electrode on the organic photoelectric conversion layer.

Assignees

• Samsung Electronics Co Ltd
• Kctech Co Ltd

Inventors

• Seo Eunsung
• Kwon Chang Gil
• Lee Sung Pyo
• Kim Dongchan
• Kim Bo Yun
• Hwang Jun Ha

Classifications

• H10P52/403

  of conductive or resistive materials · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• C09G1/00

  Polishing compositions (French polish C09F11/00; detergents C11D) · CPC title

• B24B1/00

  Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes · CPC title