Resistive grid elements having a thermosetting polymer

Patent metadata

Field	Value
Publication number	US-9824797-B2
Application number	US-201414577688-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Dec 19, 2014
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A resistor grid system includes a resistor strip including multiple pins. The resistor grid system also includes an insulation board coupled to the resistor strip through the multiple pins and configured to provide a structural support. The insulation board is made of a composite material. The composite material includes a nitrogen-containing aromatic thermosetting polymeric resin and a filler.

First claim

The invention claimed is:

1. An insulation board for a resistor grid, the insulation board comprising:
a substantially planar element made of a composite material, wherein the composite material comprises a nitrogen-containing aromatic thermosetting polymeric resin comprising a thermosetting bismaleimide resin and a filler disposed within the nitrogen-containing aromatic thermosetting polymeric resin, and wherein the thermosetting bismaleimide resin is formed from an amorphous resin formed from one or more bismaleimide monomers such that the thermosetting bismaleimide resin is at least 95 percent amorphous; and
one or more rows of transverse pin holes disposed along a length of the substantially planar element and configured to engage pins of one or more resistive elements of the resistor grid, wherein the insulation board does not include a metal supporting structure.

2. The insulation board of claim 1 , wherein the thermosetting bismaleimide resin is formed from a eutectic mixture of two or more bismaleimide monomers.

3. The insulation board of claim 1 , wherein the filler comprises a granular filler, a fibrous filler, or a combination thereof.

4. The insulation board of claim 1 , wherein the filler comprises a granular filler present in the composite material in an amount of approximately 1 to 80 weight percent based on a weight of the composite material.

5. The insulation board of claim 1 , wherein the filler comprises a fibrous filler present in the composite material in an amount of approximately 2 to 80 weight percent based on a weight of the composite material.

6. The insulation board of claim 1 , wherein the composite material comprises an adhesion promoter.

Assignees

• Gen Electric

Inventors

• Yeager Gary William
• Karmarkar Uday Prakash
• Krahn John Raymond
• Cooper Laura Susanne

Classifications

• C08L2666/66

  Substances characterised by their function in the composition · CPC title

• C08L79/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• H01C1/012 Primary

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• C07D207/448

  with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide · CPC title

• B32B2307/702

  Amorphous · CPC title