Method of manufacturing resin impregnated material, composite material and copper-clad laminate

Patent metadata

Field	Value
Publication number	US-10059083-B2
Application number	US-201615557943-A
Country	US
Kind code	B2
Filing date	Mar 22, 2016
Priority date	Mar 23, 2015
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20.

First claim

The invention claimed is:

1. A resin impregnated material obtained by impregnating a base material with a curable resin composition,
wherein the curable resin composition contains a bismaleimide compound (A) represented by General Formula (I) and a radical polymerization initiator (B), and
the base material is made of a porous fluororesin,

in Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain, and these group optionally have a hetero atom, a substituent, or a siloxane skeleton, Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group, and these groups optionally have a hetero atom, a substituent, a phenyl ether skeleton, a sulfonyl skeleton, or a siloxane skeleton, and n represents a number in the range of 1 to 20,
wherein the bismaleimide compound represented by General Formula (I) is a mixture of compounds in which n in General Formula (I) is any number in the range of 1 to 20, and a proportion of a compound in which n is 0 in the mixture is 5% to 30% by mass.

2. The resin impregnated material according to claim 1 ,
wherein the radical polymerization initiator (B) is one or two or more selected from a peroxide-based polymerization initiator, a diazo-based polymerization initiator, an alkylphenone-based polymerization initiator, an acylphosphine-based polymerization initiator, a titanocene-based polymerization initiator, and an oxime ester-based polymerization initiator.

3. The resin impregnated material according, to claim 1 ,
wherein the content ratio of the porous fluororesin in resin impregnated material is 20% to 90% by mass.

4. A method of manufacturing a copper-clad laminate comprising:
a step of semi-curing the resin impregnated material according to claim 1 to B stage state;
a step of obtaining a semi-cured laminate by laminating the semi-cured resin impregnated material and copper foil; and
a step of curing the semi-cured laminate by heating and/or energy ray irradiation to obtain the copper-clad laminate.

5. A composite material comprising:
a polymer of a bismaleimide compound represented by General Formula (I); and
a porous fluororesin,
wherein the bismaleimide compound represented by General Formula (I) is a mixture of compounds in which n in General Formula (I) is any number in the range of 1 to 20, and, a proportion of a compound in which n is 0 in the mixture is 5% to 30% by mass,

in Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in a main chain, and these groups optionally have a hetero atom, a substituent, or a siloxane skeleton, Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group, and these groups optionally have a hetero atom, a substituent, a phenyl ether skeleton, a sulfonyl skeleton, or a siloxane skeleton, and n represents a number in the range of 1 to 20.

6. The composite material according to claim 5 ,
wherein the content ratio of the porous fluororesin in composite material is 20% to 90% by mass.

7. A copper-clad laminate comprising:
copper foil that is laminated on the composite material according to claim 5 .

Assignees

• Tatsuta Electric Wire & Cable Co Ltd

Inventors

• Yoshigahara Haruyuki
• Umeda Hiroaki
• Miyamoto Masanori

Classifications

• B32B27/281

  comprising polyimides · CPC title

• C08K3/08

  Metals · CPC title

• B32B2457/12

  Photovoltaic modules · CPC title

• C08J5/24 Primary

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

• C08L79/085

  Unsaturated polyimide precursors · CPC title