Silicone-modified polyimide resin composition of solvent free type
US-2017355825-A1 · Dec 14, 2017 · US
containing silicon
containing silicon · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G73/106 |
| Official title | {containing silicon} |
| Display label | containing silicon |
| Total patents | 303 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 24 |
| 2016 | 23 |
| 2017 | 16 |
| 2018 | 33 |
| 2019 | 43 |
| 2020 | 40 |
| 2021 | 45 |
| 2022 | 18 |
| 2023 | 19 |
| 2024 | 21 |
| 2025 | 18 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Diamine compound, and heat-resistant resin or heat-resistant resin precursor using same
US-2017334837-A1 · Nov 23, 2017 · US
Substrate for display, color filter using the same and method for the production thereof, organic el element and method for the production thereof, and flexible organic el display (as amended)
US-2017309844-A1 · Oct 26, 2017 · US
Bearing material
US-9796942-B2 · Oct 24, 2017 · US
Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film
US-2017298186-A1 · Oct 19, 2017 · US
Method of making shear spun fibers and fibers made therefrom
US-2017226663-A1 · Aug 10, 2017 · US
Resin composition, cured film, laminated film, and method for manufacturing semiconductor device
US-9716026-B2 · Jul 25, 2017 · US
Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, polyimide film, and production method for laminate
US-2017190910-A1 · Jul 6, 2017 · US
Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same
US-9617451-B2 · Apr 11, 2017 · US
Composition for the production of polyimide film for flexible board of photoelectronic device
US-2017096530-A1 · Apr 6, 2017 · US
Halogenated polyimide siloxane chemical compositions and glass articles with halogenated polyimide siloxane low-friction coatings
US-2017088459-A1 · Mar 30, 2017 · US
Aliphatic polyimides from a 1:1 molar ratio of diamine and unsaturated monoanhydride or unsaturated diacid
US-2017044320-A1 · Feb 16, 2017 · US
Aliphatic polyimides from unsaturated monoanhydride or unsaturated diacid reacted with both monoamine and diamine
US-2017044319-A1 · Feb 16, 2017 · US
Organically modified hybrid aerogels
US-9527977-B2 · Dec 27, 2016 · US
Polyimide precursor composition and use thereof and polyimide made therefrom
US-2016369056-A1 · Dec 22, 2016 · US
Polyimide resin and metal-clad laminate comprising the same
US-2016369053-A1 · Dec 22, 2016 · US
Polyimide resin, resin composition using same, and laminated film
US-2016372357-A1 · Dec 22, 2016 · US
Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same
US-2016374208-A1 · Dec 22, 2016 · US
Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same
US-2016340558-A1 · Nov 24, 2016 · US
Polyimide precursor, polyimide, flexible substrate prepared therewith, color filter and production method thereof, and flexible display device
US-9493614-B2 · Nov 15, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G73/106?
- CPC C08G73/106 is the Cooperative Patent Classification code for “containing silicon.”
- How many patents are filed under CPC C08G73/106 (containing silicon)?
- Our database includes 303 publications tagged with this CPC code.
- Is patent activity under CPC C08G73/106 growing?
- Publication counts under this code: 21 in 2024 vs 18 in 2025 (latest complete years).