Polyimide resin and metal-clad laminate comprising the same

Patent metadata

Field	Value
Publication number	US-2016369053-A1
Application number	US-201615185895-A
Country	US
Kind code	A1
Filing date	Jun 17, 2016
Priority date	Jun 17, 2015
Publication date	Dec 22, 2016
Grant date	—

Abstract

The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.

First claim

What is claimed is:

1 . A polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA).

2 . The polyimide resin according to claim 1 , which has a first glass transition temperature in the range of about 270° C. to about 315° C. and a second glass transition temperature in the range of about 350° C. to about 450° C.

3 . The polyimide resin according to claim 1 , which has a first glass transition temperature in the range of about 280° C. to about 310° C. and a second glass transition temperature in the range of about 370° C. to about 445° C.

4 . The polyimide resin according to claim 3 , wherein the first glass transition temperature is in the range of about 285° C. to about 305° C.

5 . The polyimide resin according to claim 2 , wherein the first glass transition temperature comes from a first polyimide and the first polyimide is in an amount of about 5 mol % to about 50 mole %, based on the total of the polyimide resin components.

6 . The polyimide resin according to claim 5 , wherein the first polyimide is in an amount of about 10 mol % to about 45 mole %, based on the total of the polyimide resin components.

7 . The polyimide resin according to claim 2 , which has a coefficient of thermal expansion in the range of 15 to 30 ppm/° C.

8 . The polyimide resin according to claim 2 , wherein the first glass transition temperature comes from a first polyimide and the first polyimide comprises a polymerization unit derived from a long-chain diamine monomer and an aromatic diamine monomer.

9 . The polyimide resin according to claim 8 , wherein the long-chain diamine monomer used in the present disclosure comprises:

H 2 N—R 2 —NH 2 (B) or a combination thereof, wherein each R 1 is independently H, C 1 -C 4 alkyl, or phenyl; k may be the same or different and is an integer greater than 0; m is an integer greater than 0; and R 2 is C 2 -C 14 alkylene.

10 . The polyimide resin according to claim 8 , wherein the amount of the long-chain diamine monomer, based on the total moles of the diamine monomers contained in the first polyimide, is from about 5 mol % to about 40 mol %.

11 . The polyimide resin according to claim 8 , wherein the second glass transition temperature comes from a second polyimide and the second polyimide comprises a polymerization unit derived from a rigid diamine monomer, wherein the rigid diamine monomer comprises:

or a combination thereof.

12 . The polyimide resin according to claim 1 , having adhesion upon hot pressing.

13 . A metal clad laminate, comprising:
a first metal foil; a first polyimide layer directly disposed on the first metal foil; a second metal foil; and a second polyimide layer directly disposed on the second metal foil; wherein the first polyimide layer is in contact with the second polyimide layer and wherein the first polyimide layer and/or the second polyimide layer comprises the polyimide resin according to claim 1 .

14 . The metal clad laminate according to claim 13 , wherein the peeling strength between the first polyimide layer and the second polyimide layer is about 3 gf/cm to about 100 gf/cm.

Assignees

• Eternal Mat Co Ltd

Inventors

• Chiang Shun-Jen
• Wu Chung-Jen
• Huang Po-Yu
• Chou Meng-Yen
• Ho Chang-Hong
• Cheng Chun-Kai

Classifications

• B32B15/08

  of synthetic resin · CPC title

• C08G73/10

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• B32B2250/40

  Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA · CPC title