Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, polyimide film, and production method for laminate

Patent metadata

Field	Value
Publication number	US-2017190910-A1
Application number	US-201515313216-A
Country	US
Kind code	A1
Filing date	May 18, 2015
Priority date	May 24, 2014
Publication date	Jul 6, 2017
Grant date	—

Abstract

The present invention has an object to obtain a polyimide film that has a sufficiently smooth surface without peeling even in a case where the polyimide film is a thick film and that is excellent in adhesion to an inorganic substrate. An alkoxysilane-modified polyamic acid solution of the present invention contains: an alkoxysilane-modified polyamic acid; and a surface control agent, the alkoxysilane-modified polyamic acid solution having a specific viscosity, the alkoxysilane-modified polyamic acid being obtained by reacting a polyamic acid with an alkoxysilane compound containing an amino group, and the polyamic acid being obtained by reacting a diamine with a tetracarboxylic dianhydride.

First claim

1 . An alkoxysilane-modified polyamic acid solution comprising:
an alkoxysilane-modified polyamic acid; and a surface control agent, the alkoxysilane-modified polyamic acid solution having a viscosity of 1,200 mPa·s to 20,000mPa·s, the alkoxysilane-modified polyamic acid being obtained by reacting, in a polyamic acid solution, a polyamic acid with an alkoxysilane compound containing an amino group, and the polyamic acid being obtained by reacting a diamine with a tetracarboxylic dianhydride.

2 . The alkoxysilane-modified polyamic acid solution as set forth in claim 1 , wherein the surface control agent is an acrylic compound or a silicone compound.

3 . The alkoxysilane-modified polyamic acid solution as set forth in claim 1 , wherein the surface control agent is added in an amount of 0.0001 parts by weight or more and 0.1 parts by weight or less with respect to 100 parts by weight of the alkoxysilane-modified polyamic acid.

4 . The alkoxysilane-modified polyamic acid solution as set forth in claim 1 , wherein the alkoxysilane-modified polyamic acid solution contains an amide solvent as a main solvent.

5 . The alkoxysilane-modified polyamic acid solution as set forth in claim 4 , wherein the amide solvent is N-methyl-2-pyrolidone.

6 . The alkoxysilane-modified polyamic acid solution as set forth in claim 1 , wherein the alkoxysilane-modified polyamic acid solution contains, in an amount of 100 pieces/g or smaller, foreign matter having a size of 0.5 μm or more.

7 . The alkoxysilane-modified polyamic acid solution as set forth in claim 1 , wherein:
the tetracarboxylic dianhydride is 3,3′,4,4′-biphenyltetracarboxylic dianhydride; and the diamine is a diamine represented by the following formula (1):

wherein n is any integer of 1 to 3.

8 . The alkoxysilane-modified polyamic acid solution as set forth in claim 1 , wherein the alkoxysilane compound is added in an amount of 0.01 parts by weight to 0.50 parts by weight in a case where the polyamic acid is contained in the alkoxysilane-modified polyamic acid solution in an amount of 100 parts by weight.

9 . The alkoxysilane-modified polyamic acid solution as set forth in claim 1 , wherein the tetracarboxylic dianhydride reacts with the diamine in a molar ratio of 0.980 or more and less than 1.000 with respect to the diamine, the molar ratio being obtained by dividing a total number of moles of the tetracarboxylic dianhydride by a total number of moles of the diamine.

10 . A laminate comprising:
a polyimide film; and an inorganic substrate, the laminate being obtained by the steps of: casting, on the inorganic substrate, an alkoxysilane-modified polyamic acid solution recited in claim 1 ; and heating and imidizing the alkoxysilane-modified polyamic acid solution.

11 . A method for producing a laminate,
the laminate including:
a polyimide film; and
an inorganic substrate,
the method comprising the steps of: casting, on the inorganic substrate, an alkoxysilane-modified polyamic acid solution recited in claim 1 ; and subjecting the alkoxysilane-modified polyamic acid solution to thermal imidization, the thermal imidization being started at 100° C. to 150° C.

12 . A method for producing a polyimide film,
the method comprising the step of: peeling the polyimide film from an inorganic substrate of a laminate obtained by a method recited in claim 11 .

13 . A laminate comprising:
a polyimide film obtained from an alkoxysilane-modified polyamic acid solution recited in claim 1 ; and an inorganic substrate to which the polyimide film is laminated, the polyimide film having a coefficient of linear thermal expansion of 20 ppm/° C. or less.

14 . A flexible device comprising:
a polyimide film obtained from an alkoxysilane-modified polyamic acid solution recited in claim 1 ; and an electronic element provided on the polyimide film.

Assignees

• Kaneka Corp

Inventors

• Uno Mari
• Horii Etsuo

Classifications

• B29L2031/3475

  Displays, monitors, TV-sets, computer screens · CPC title

• B29C39/006

  Monomers or prepolymers (by reaction injection moulding B29C67/246) · CPC title

• C08J2379/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• B29K2079/08

  PI, i.e. polyimides or derivatives thereof · CPC title

• C08L2201/56

  Non-aqueous solutions or dispersions · CPC title