Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9617451-B2
Application number	US-201515111265-A
Country	US
Kind code	B2
Filing date	Jan 9, 2015
Priority date	Jan 15, 2014
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

First claim

The invention claimed is:

1. An adhesive composition comprising a polyimide (A), a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), wherein the polyimide (A) has at least one functional group capable of reacting with an epoxy group on its side chain, the polyfunctional epoxy compound (B) contains a liquid epoxy compound and a bisphenol A epoxy resin having an epoxy equivalent weight of 1000 or more and 7000 or less, the epoxy curing agent (C) is an imidazole-based curing agent,
the ratio of the polyimide (A) in a nonvolatile organic component is 17.5 wt % or more and 30 wt % or less,
the ratio of the liquid epoxy compound in the nonvolatile organic component is 20 wt % or more and 50 wt % or less,
the ratio of the bisphenol A epoxy resin in the nonvolatile organic component is 30 wt % or more and 70 wt % or less,
the ratio of the epoxy curing agent (C) in the nonvolatile organic component is 1.0 wt % or more and 10 wt % or less, and
T/M is 400 or more and 8000 or less when the total number of grams of the nonvolatile organic component is denoted by T, and the number of moles of epoxy groups in the nonvolatile organic component is denoted by M.

2. The adhesive composition according to claim 1 , wherein the polyimide (A) has a structure represented by a general formula (2) or a general formula (3), has at least one functional group capable of reacting with an epoxy group on its side chain, and has a structure represented by a general formula (1) as R4 in the general formula (2) or the general formula (3) in an amount of 5 wt % or more and 15 wt % or less with respect to the total amount of polymers:

in which R 1 is a divalent hydrocarbon group, R 2 is a monovalent hydrocarbon group, R 1 and R 2 having different structures may be contained in a molecule of the polyimide, or R 1 and R 2 having different structures may be contained in different polyimide molecules, and n represents an integer of 1 to 10,

in which R 3 is a tetra- to 14-valent organic group, R 4 is a di- to 12-valent organic group, at least one of R 3 and R 4 contains at least one group selected from the group consisting of a 1,1,1,3,3,3-hexafluoropropyl group, an isopropyl group, an ether group, a thioether group and a SO 2 group, R 5 and R 6 each represent an organic group having at least one group selected from the group consisting of a phenolic hydroxyl group, a sulfonic acid group and a thiol group. R 3 to R 6 having different structures may be contained in a molecule of the polyimide, or R 3 to R 6 having different
structures may be contained in different polyimide molecules. X represents a monovalent organic group: m is 8 to 200, α and β each represent an integer of 0 to 10 and α+β is an integer of 0 to 10; however, 20 to 90% of the structural units whose repeating number is m show α+β=1 to 10.

3. The adhesive composition according to claim 2 , wherein n in the general formula (1) is an integer of 1 to 2.

4. The adhesive composition according to claim 1 , wherein the content of the inorganic particles (D) in a nonvolatile component is 50 wt % or more and 80 wt % or less.

5. The adhesive composition according to claim 1 , wherein the elastic modulus at −40° C. of the cured adhesive composition is 10 GPa or more and 15 GPa or less.

6. The adhesive composition according to claim 1 , wherein the maximum strength at 23° C. of the cured adhesive composition is 28 N or more.

7. An adhesive film having a layer composed of the adhesive composition according to claim 1 , and a support film.

8. A substrate provided with the adhesive composition having a layer composed of the adhesive composition according to claim 1 , and a substrate.

9. A semiconductor device having a layer composed of the adhesive composition according to claim 1 .

10. A method for producing a semiconductor device in which the adhesive composition according to claim 1 is interposed between a first circuit member and a second circuit member, and the first circuit member is electrically connected to the second circuit member by heating/applying pressure to the adhesive composition.

Assignees

• Toray Industries

Inventors

• Oda Takuro
• Kanamori Daisuke
• Nonaka Toshihisa

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• C09J2463/00

  Presence of epoxy resin · CPC title

• H05K3/321

  by conductive adhesives · CPC title

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C09D163/00

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title