Composition including a polythiol, a polyepoxide, an amine catalyst, and a conductive filler and methods relating to the composition
US-2021403700-A1 · Dec 30, 2021 · US
Amides
Amides · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/44 |
| Official title | Amides |
| Display label | Amides |
| Total patents | 104 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 9 |
| 2017 | 9 |
| 2018 | 8 |
| 2019 | 9 |
| 2020 | 12 |
| 2021 | 9 |
| 2022 | 11 |
| 2023 | 10 |
| 2024 | 9 |
| 2025 | 9 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Encapsulating or filling composition for electronic devices and electronic apparatus
US-2021292546-A1 · Sep 23, 2021 · US
Seal material composition, liquid crystal cell, and scanned antenna
US-11078324-B2 · Aug 3, 2021 · US
Curable composition including epoxy resin and curable solid filler
US-11078358-B2 · Aug 3, 2021 · US
Two-part epoxy based composition
US-2021171694-A1 · Jun 10, 2021 · US
Two-component epoxy resin paint
US-10844239-B2 · Nov 24, 2020 · US
Heat dissipating paint composition and method for forming heat dissipating coating
US-2020325356-A1 · Oct 15, 2020 · US
Polyamides and amidoamines derived from hyroxyalkylpolyamines: epoxy curing agents with improved properties
US-2020308339-A2 · Oct 1, 2020 · US
Coating film having chemical resistance
US-10752729-B2 · Aug 25, 2020 · US
Curable compositions, articles therefrom, and methods of making and using same
US-2020259137-A1 · Aug 13, 2020 · US
Multi-component solid epoxy proppant binder resins
US-10738583-B2 · Aug 11, 2020 · US
Amidoamine and polyamide curing agents, compositions, and methods
US-10676564-B2 · Jun 9, 2020 · US
Long-chain alkylene group-containing epoxy resin composition
US-10669369-B2 · Jun 2, 2020 · US
Curable composition including epoxy resin and curable solid filler
US-2020148878-A1 · May 14, 2020 · US
Polyamides and amidoamines derived from hyroxyalkylpolyamines: epoxy curing agents with improved properties
US-2020123312-A1 · Apr 23, 2020 · US
Epoxy resin composition, prepreg for fiber-reinforced composite material, and fiber-reinforced composite material
US-10577455-B2 · Mar 3, 2020 · US
Resin composition, molded article, laminate, coating material, and adhesive
US-2020002465-A1 · Jan 2, 2020 · US
Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same
US-10501618-B2 · Dec 10, 2019 · US
Structural adhesive compositions
US-2019330502-A1 · Oct 31, 2019 · US
Seal material composition, liquid crystal cell, and scanned antenna
US-2019292307-A1 · Sep 26, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/44?
- CPC C08G59/44 is the Cooperative Patent Classification code for “Amides.”
- How many patents are filed under CPC C08G59/44 (Amides)?
- Our database includes 104 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/44 growing?
- Publication counts under this code: 9 in 2024 vs 9 in 2025 (latest complete years).