Curable composition including epoxy resin and curable solid filler

Patent metadata

Field	Value
Publication number	US-11078358-B2
Application number	US-201816494976-A
Country	US
Kind code	B2
Filing date	Jul 25, 2018
Priority date	Jul 31, 2017
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25° C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same.

First claim

What is claimed is:

1. A curable composition comprising:
a liquid epoxy resin component;
a curative component; and
a curable resin filler component, at least a portion of which is dispersed in the liquid epoxy resin and having a melting point in the range of from 50° C. to 250° C.,
wherein both the curable resin filler and curative component remain solid within the curable composition at 25° C. such that a film comprising the curable composition is tacky and is capable of being cut and applied to a substrate.

2. The curable composition according to claim 1 , wherein the liquid epoxy resin component comprises one or more epoxy resins chosen from a diglycidyl ether of bisphenol F, a low epoxy equivalent weight diglycidyl ether of bisphenol A, a liquid epoxy novolac, a liquid aliphatic epoxy, a liquid cycloaliphatic epoxy, a 1,4-cyclohexandimethanoldiglycidylether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, tetraglycidylmethylenedianiline, N,N,N′,N′-tetraglycidyl-4,4′ methylenebisbenzenamine, a triglycidyl of para-aminophenol, N,N,N′,N′-tetraglycidyl-m-xylenediamine, and a mixture thereof.

3. The curable composition according to claim 1 , wherein the curable resin filler component is in the range of from about 2 wt % to about 70 wt % of the curable composition.

4. The curable composition according to claim 1 , wherein the curable resin filler component comprises one or more resins chosen from a solid epoxy resin, a bismaleimide resin, a polyimide resin, a cyanate ester resin, a benzoxazine resin, and a mixture thereof.

5. The curable composition according to claim 1 , further comprising a thermoplastic polymer filler component.

6. The curable composition of claim 5 , wherein the thermoplastic polymer filler component is in the range of from about 5 wt % to about 80 wt % of the curable composition.

7. The curable composition according to claim 5 , wherein the thermoplastic polymer filler component comprises one or more thermoplastic polymers chosen from an acrylate, an alkyl(meth) acrylate, a polyamide-imide, a polyetherimide, a polysulfone, a polyamide, a polyvinylchloride, an acrylonitrile butadiene styrene, a polystyrene, a polyether ether ketone, a polyetherketoneketone, a polytetrafluoroethylene, a polyphenylene sulphide, a polyethylene terephthalate, a polyoxymethylene, a polypropylene, a high density polyethylene, a low density polyethylene, a polypropylene, a siloxane, a polyoxymethylene, a polycarbonate, a polyarylsulfone, a polyethersulfone, a polyphenlysulfone, and a mixture thereof.

8. The curable composition according to claim 7 , wherein a weight average molecular weight of at least one of the thermoplastic polymers is in the range of from about 5,000 daltons to about 100,000 daltons.

9. The curable composition of claim 5 , wherein about 50 wt % to about 100 wt % of the one or more thermoplastic polymers are solid in the curable composition at a temperature of 25° C.

10. The curable composition according to claim 1 , wherein the curative component comprises one or more curative compounds chosen from an aliphatic polyamine compound, an aromatic polyamine compound, an aromatic polyamide compound, an alicyclic polyamine compound, a polyamine compound, a polyamide compound, an amino resin compound, a 9,9-bis(aminophenyl)fluorene compound, and a mixture thereof.

11. The curable composition according to claim 1 , further comprising core-shell rubber nanoparticles.

12. The curable composition according to claim 11 , wherein the curable composition comprises:
about 15 wt % to about 55 wt % of the liquid epoxy resin component;
about 10 wt % to about 53 wt % of the curative component;
about 15 wt % to about 25 wt % of the curable resin filler component;
about 15 wt % to about 25 wt % thermoplastic filler component; and
about 2 wt % to about 30 wt % of the core-shell rubber nanoparticles.

13. A method of making the curable composition according to claim 1 , the method comprising:
adding the curative component to a first solution comprising the liquid epoxy resin component and the curable resin filler component to form a second solution; and
forming the curable composition.

14. The method of claim 13 , further comprising mixing the first solution.

15. The method according to claim 13 , further comprising mixing the second solution.

16. The method according to claim 13 , further comprising adding the thermoplastic resin to the second solution.

17. A cured product of the curable composition according to claim 1 .

18. The cured product according to claim 17 , wherein a Wet Glass Transition Temperature and a Dry Glass Transition Temperature of the cured product are substantially equal.

19. The cured product according to claim 18 , wherein the Wet Glass Transition Temperature and the Dry Glass Transition Temperature of the cured product independently is in the range of from about 100° C. to about 300° C.

20. The curable composition according to claim 1 , wherein the tacky film product has a thickness range of 0.1 mm to 1.20 mm.

21. The curable composition according to claim 20 , wherein the tacky film product has a thickness range from 2 mm to 15 mm.

Assignees

• 3M Innovative Properties Co

Inventors

• Chen Lianzhou
• Hansen Kristen J

Classifications

• C08K7/02

  Fibres or whiskers · CPC title

• C08G59/38

  together with di-epoxy compounds · CPC title

• C08K5/17

  Amines; Quaternary ammonium compounds · CPC title

• C08K2201/011

  Nanostructured additives · CPC title

• C08G59/44 Primary

  Amides · CPC title