Long-chain alkylene group-containing epoxy resin composition

Patent metadata

Field	Value
Publication number	US-10669369-B2
Application number	US-201615775132-A
Country	US
Kind code	B2
Filing date	Nov 10, 2016
Priority date	Nov 10, 2015
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent:

wherein R 1 to R 3 each independently are a hydrogen atom or methyl group, and L 1 to L 3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

First claim

The invention claimed is:

1. An epoxy resin composition comprising:
(a) an epoxy component containing at least an epoxy compound of formula [1]; and
(b) a curing agent,

where:
each of R 1 to R 3 is a hydrogen atom, and
each of L 1 to L 3 each is a hexamethylene group, and

wherein the epoxy resin composition optionally includes an acid generator as a curing catalyst in addition to the curing agent but not as the curing agent.

2. The epoxy resin composition according to claim 1 , wherein (b) the curing agent is at least one selected from the group consisting of an acid anhydride, an amine, a phenol resin, a polyamide resin, imidazoles and a polymercaptan.

3. The epoxy resin composition according to claim 2 , wherein (b) the curing agent is an acid anhydride.

4. The epoxy resin composition according to claim 1 , wherein (b) the curing agent is contained in a proportion of 0.5 to 1.5 equivalents per equivalent of epoxy group of (a) the epoxy component.

5. A composition for coating a metal wiring, comprising the epoxy resin composition according to claim 1 .

6. A cured product of the epoxy resin composition according to claim 1 .

7. A wiring board, comprising a cured product of the epoxy resin composition according to claim 1 , and a metal wiring, wherein the cured product and the metal wiring are in contact with each other.

Assignees

• Nissan Chemical Ind Ltd

Inventors

• Suwa Takeshi
• Endo Yuki
• Tadokoro Sayoko

Classifications

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08L63/06

  Triglycidylisocyanurates · CPC title

• C08G59/66

  Mercaptans · CPC title

• H05K1/03

  Use of materials for the substrate · CPC title

• C08G59/027 Primary

  obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer · CPC title