Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same

Patent metadata

Field	Value
Publication number	US-10008646-B2
Application number	US-201615209542-A
Country	US
Kind code	B2
Filing date	Jul 13, 2016
Priority date	Jul 14, 2015
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature, comprising:
(A) a prepolymer obtained by reacting at least one component of (A-1), (A-2) and (A-3); and (A-4),
(A-1) a triazine derivative epoxy resin having not less than three epoxy groups in one molecule, (A-2) at least one epoxy resin that is non-fluid at 25° C. and selected from the group consisting of a bisphenol-type epoxy resin, a hydrogenated bisphenol-type epoxy resin, an alicyclic epoxy resin and monoalkyl diglycidyl isocyanurate, (A-3) a cyclic siloxane compound having not less than two epoxy groups in one molecule, and (A-4) an acid anhydride curing agent in a liquid state at 25° C.; (A′) a component(s) among (A-1) to (A-3) that is/are not used in said prepolymer (A); and
(B) a curing accelerator.

First claim

What is claimed:

1. A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature, comprising:
(A) a prepolymer obtained by reacting at least one component of (A-1), (A-2) and (A-3); (A-4); and (D),
(A-1) a triazine derivative epoxy resin having not less than three epoxy groups in one molecule,
(A-2) at least one epoxy resin that is non-fluid at 25° C. and selected from the group consisting of a bisphenol-type epoxy resin, a hydrogenated bisphenol-type epoxy resin, an alicyclic epoxy resin and monoalkyl diglycidyl isocyanurate,
(A-3) a cyclic siloxane compound having not less than two epoxy groups in one molecule,
(A-4) an acid anhydride curing agent which is an acid anhydride curing agent in a liquid state at 25° C.; or a liquid mixture prepared by dissolving an acid anhydride in a solid state at 25° C. into an acid anhydride in a liquid state at 25° C., and
(D) an acrylic block copolymer,
wherein a ratio of a total number of epoxy groups in (A-1), (A-2) and (A-3) to a total number of acid anhydride groups in (A-4) is 0.6 to 2.0, wherein at least one of components
(A-1), (A-2) and (A-3) is reacted with component (A-4) to prepare (A);
(A′) all of component(s) among (A-1) to (A-3) that is/are not used in said prepolymer (A), said component(s) (A-1), (A-2) and (A-3) being optional if all of said components (A-1), (A-2) and (A-3) are reacted with component (A-4) to prepare (A); and
(B) a curing accelerator.

2. The heat-curable epoxy resin composition for optical semiconductor element encapsulation according to claim 1 , wherein said prepolymer (A) is obtained by reacting at least one component of (A-1), (A-2) and (A-3); (A-4); (D); and an antioxidant as a component (C).

3. An optical semiconductor device having an optical semiconductor element encapsulated by the heat-curable epoxy resin composition for optical semiconductor element encapsulation as set forth in claim 2 .

4. An optical semiconductor device having an optical semiconductor element encapsulated by the heat-curable epoxy resin composition for optical semiconductor element encapsulation as set forth in claim 1 .

Assignees

• Shinetsu Chemical Co

Inventors

• Tsutsumi Yoshihiro
• Tomita Tadashi

Classifications

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08G59/685

  Carboxylates · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title

• C08G59/3281 Primary

  containing silicon · CPC title