Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
US-12234318-B2 · Feb 25, 2025 · US
containing phosphorus
containing phosphorus · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/304 |
| Official title | {containing phosphorus} |
| Display label | containing phosphorus |
| Total patents | 59 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 2 |
| 2017 | 7 |
| 2018 | 5 |
| 2019 | 8 |
| 2020 | 9 |
| 2021 | 8 |
| 2022 | 2 |
| 2023 | 2 |
| 2024 | 6 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board
US-12209160-B2 · Jan 28, 2025 · US
Solvent-less ionic liquid epoxy resin
US-11976162-B2 · May 7, 2024 · US
One-component toughened epoxy adhesives
US-2024093072-A1 · Mar 21, 2024 · US
Resin composition, method for forming cured product, and cured product
US-11905388-B2 · Feb 20, 2024 · US
Flame retardant levulinic acid-based compounds
US-11884866-B2 · Jan 30, 2024 · US
Adhesion promoters and compositions for containers and other articles
US-2024018382-A1 · Jan 18, 2024 · US
Solvent-less ionic liquid epoxy resin
US-11859077-B2 · Jan 2, 2024 · US
Adhesion promoters and compositions for containers and other articles
US-11667809-B2 · Jun 6, 2023 · US
Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
US-2023045615-A1 · Feb 9, 2023 · US
Resin composition, method for forming cured product, and cured product
US-2022282059-A1 · Sep 8, 2022 · US
Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board
US-2022185945-A1 · Jun 16, 2022 · US
Curable resin composition and adhesive for bonding structural material using composition
US-11208579-B2 · Dec 28, 2021 · US
Solvent-less ionic liquid epoxy resin
US-2021363341-A1 · Nov 25, 2021 · US
Levoglucosan-based flame retardant compounds
US-11174435-B2 · Nov 16, 2021 · US
Resveratrol-based flame retardant materials
US-11078425-B2 · Aug 3, 2021 · US
Flame retardant levulinic acid-based compounds
US-2021139783-A1 · May 13, 2021 · US
Solvent-less ionic liquid epoxy resin
US-10975238-B2 · Apr 13, 2021 · US
Flame retardant levulinic acid-based compounds
US-10947454-B2 · Mar 16, 2021 · US
Phosphorous containing epoxy resins and process for synthesis
US-10899871-B2 · Jan 26, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/304?
- CPC C08G59/304 is the Cooperative Patent Classification code for “containing phosphorus.”
- How many patents are filed under CPC C08G59/304 (containing phosphorus)?
- Our database includes 59 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/304 growing?
- Publication counts under this code: 6 in 2024 vs 2 in 2025 (latest complete years).