Solvent-less ionic liquid epoxy resin

US10975238B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10975238-B2
Application numberUS-201716344751-A
CountryUS
Kind codeB2
Filing dateOct 24, 2017
Priority dateOct 25, 2016
Publication dateApr 13, 2021
Grant dateApr 13, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y1—R1—Y2), wherein R1 is an ionic moiety Y1 is a nucleophilic group and Y2 nucleophilic group; and an ionic moiety A acting as a counter ion to R1; and an epoxy compound E comprising: a molecular structure (Z1R2—Z2), wherein R1 is an ionic moiety, Z1 comprises an epoxide group, and Z2 comprises an epoxide group; and an ionic moiety B acting as a counter ion to R2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of used.

First claim

Opening claim text (preview).

What is claimed is: 1. A low or solvent free epoxy system comprising: a hardener compound H comprising: a molecular structure (Y 1 —R 1 —Y 2 ), wherein R 1 is an ionic moiety, Y 1 comprises a nucleophilic group, Y 2 comprises a nucleophilic group, and including an ionic moiety A acting as a counter ion to R 1 ; an epoxy compound E comprising: a molecular structure (Z 1 —R 2 —Z 2 ), wherein R 2 is an ionic moiety, Z 1 comprises an epoxide group, Z 2 comprises an epoxide group, and including an ionic moiety B acting as a counter ion to R 2 ; wherein R 1 and R 2 are of opposite charge, ionic moiety A and ionic moiety B are of opposite charge, and wherein R 1 and ionic moiety A are of opposite charge and R 2 and ionic moiety B are of opposite charge; and wherein ionic moiety A and ionic moiety B are capable to form a secondary ionic liquid upon reaction of the hardener compound H with the epoxy compound E. 2. The epoxy system of claim 1 , wherein the epoxy compound E is a solventless ionic liquid. 3. The epoxy system of claim 1 , wherein Y 1 and Y 2 comprise a nucleophile independently selected from: a NH 2 group, a SH group, an OH group, a SeH group, and a PH 2 group. 4. The epoxy system of claim 1 , wherein the hardener compound H is a solvent-less ionic liquid. 5. The epoxy system of claim 1 , further comprising one or more of an accelerator, a crosslinker, a plasticizer, or an inhibitor. 6. The epoxy system of claim 1 , wherein the secondary ionic liquid comprises an ionic hydrophobic and/or super-hydrophobic compound, the secondary ionic liquid formed upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 7. The epoxy system of claim 1 , wherein the secondary ionic liquid comprises an ionic hydrophilic compound, the secondary ionic liquid formed upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 8. The epoxy system of claim 1 , wherein the secondary ionic liquid comprises an ionic transitional hydrophobic/hydrophilic compound, the secondary ionic liquid formed upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 9. The epoxy system of claim 1 , wherein the secondary ionic liquid comprises a biological active (BAIL, Biological Active Ionic Liquid) compound, the secondary ionic liquid formed upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 10. The epoxy system of claim 1 , wherein the secondary ionic liquid comprises a plasticizer compound, the secondary ionic liquid formed upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 11. The epoxy system of claim 10 , wherein the plasticizer compound has a low to zero volatility. 12. The epoxy system of claim 1 , wherein a polymer produced upon polymerization of hardener compound H and epoxy compound E comprises self-healing properties due to the presence of stable electrical charges along to the polymeric chains that drive the healing process through electrostatic attraction. 13. The epoxy system of claim 1 , wherein a polymer produced upon polymerization of hardener compound H and epoxy compound E forms a highly and regular porous system. 14. The epoxy system of claim 13 , wherein the polymer produced is a filtration membrane, a solid electrolyte, or an exchange membrane. 15. A polymer produced by the polymerization of the epoxide system of claim 1 . 16. The polymer of claim 15 , wherein the polymer comprises a solid electrolyte. 17. An electronic component comprising the polymer of claim 16 . 18. The electronic component of claim 17 , wherein electronic component is a component of a battery, a capacitor, a piezoelectric material and/or an electro-actuator.

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Classifications

  • Manufacturing or production processes characterised by the final manufactured product · CPC title

  • having one nitrogen atom in the ring · CPC title

  • aromatic · CPC title

  • containing phosphorus · CPC title

  • Five-membered rings · CPC title

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What does patent US10975238B2 cover?
Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y1—R1—Y2), wherein R1 is an ionic moiety Y1 is a nucleophilic group and Y2 nucleophilic group; and an ionic moiety A acting as a counter ion to R1; and an epoxy compound E comprising: a molecular structure (Z1R2—Z2), wherein R1 is an ionic moiety, Z1 comprises an epoxide group, and Z2 comprises an …
Who is the assignee on this patent?
Univ Arizona State
What technology area does this patent fall under?
Primary CPC classification C08G59/5073. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 13 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).