Resin composition, method for forming cured product, and cured product

Patent metadata

Field	Value
Publication number	US-11905388-B2
Application number	US-202017632685-A
Country	US
Kind code	B2
Filing date	Aug 11, 2020
Priority date	Aug 23, 2019
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 μm, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.

First claim

The invention claimed is:

1. A resin composition comprising:
(A) copper particles having an average particle diameter in a range from 0.1 to 20 μm;
(B) phosphoric acid-modified epoxy resin obtained by reacting phosphoric acid (b1) with an epoxy compound (b2);
(C) a curing agent; and
(D) xylene resin, resol type phenol resin, or a combination thereof, excluding the component (B),
wherein a content of the component (B), a content of the component (C), and a content of the component (D), each relative to a total amount of the components (A), (B), and (C) as 100 parts by mass, are in a range from 0.1 to 30 parts by mass, in a range from 0.1 to 5 parts by mass, and in a range from 1 to 30 parts by mass, respectively, and wherein a volume resistance value of a cured product of the composition does not exceed 1.5×10 −3 (Ω·cm), where the volume resistance value of the cured product is measured by coating a glass substrate with the composition so as to have a thickness of 30 μm, heating the coating at temperature of 150° C. for 30 minutes, and measuring the volume resistance value of the heated coating by a four-point probe method.

2. A method for forming a cured product, comprising:
applying the resin composition according to claim 1 on a substrate; and
curing the resin composition by heating the substrate on which the resin composition has been applied.

3. The method for forming a cured product according to claim 2 , wherein the substrate on which the resin composition has been applied is heated at a temperature in a range from 50 to 250° C. for a period in a range from 1 to 200 minutes.

4. A cured product obtained by curing the resin composition according to claim 1 .

5. The resin composition according to claim 1 ,
wherein the component (D) is the xylene resin.

6. The resin composition according to claim 5 ,
wherein the xylene resin is resol type xylene resin.

7. The resin composition according to claim 1 ,
wherein the component (D) is the resol type phenol resin.

8. The resin composition according to claim 1 ,
wherein the component (D) is the combination of the xylene resin and the resol type phenol resin.

9. The resin composition according to claim 1 ,
wherein a phenolic compound present in the resin composition, other than the component (B), consists of the resol type phenol resin in the component (D) if the component (D) is the resol type phenol resin or the combination.

Assignees

• Adeka Corp

Inventors

• Nuida Yusuke
• Hosokawa Hitoshi
• Morita Hiroshi

Classifications

• C08K3/08 Primary

  Metals · CPC title

• C08G59/1488 Primary

  containing phosphorus · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/304

  containing phosphorus · CPC title

• C08G59/3272

  containing phosphorus · CPC title