Method for atomic diffusion bonding and bonded structure
US-12583204-B2 · Mar 24, 2026 · US
characterised by the interlayer used (C04B37/047 takes precedence)
characterised by the interlayer used (C04B37/047 takes precedence) · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B37/045 |
| Official title | {characterised by the interlayer used (C04B37/047 takes precedence)} |
| Display label | characterised by the interlayer used (C04B37/047 takes precedence) |
| Total patents | 39 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 2 |
| 2017 | 3 |
| 2018 | 3 |
| 2019 | 5 |
| 2020 | 3 |
| 2021 | 3 |
| 2022 | 4 |
| 2023 | 6 |
| 2024 | 6 |
| 2025 | 2 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic device housing, manufacturing method thereof, and electronic device
US-12382600-B2 · Aug 5, 2025 · US
Method for integrally bonding a glass element to a support element, and optical device
US-12338183-B2 · Jun 24, 2025 · US
YAG ceramic joined body and production method therefor
US-12160081-B2 · Dec 3, 2024 · US
Method for integrally bonding a glass element to a support element, and optical device
US-2024343654-A1 · Oct 17, 2024 · US
Electronic device housing, electronic device, and compound body
US-12075583-B2 · Aug 27, 2024 · US
Joined body production method and joined body production device
US-12017439-B2 · Jun 25, 2024 · US
Sealing lid formed from translucent material
US-12002723-B2 · Jun 4, 2024 · US
Electronic device housing and electronic device including the same
US-11974405-B2 · Apr 30, 2024 · US
Composite wafer and manufacturing method therefor
US-2023391055-A1 · Dec 7, 2023 · US
Bonded articles and methods for forming the same
US-2023347622-A1 · Nov 2, 2023 · US
Method for making a thermally stable connection between a glass element and a support element, method for producing an optical device, and optical device
US-11712753-B2 · Aug 1, 2023 · US
Method for making a thermally stable connection between a glass element and a support element, method for producing an optical device, and optical device
US-2023123641-A1 · Apr 20, 2023 · US
Method for atomic diffusion bonding and bonded structure
US-2023083722-A1 · Mar 16, 2023 · US
Electronic device housing and electronic device including the same
US-2023065427-A1 · Mar 2, 2023 · US
Yag ceramic joined body and production method therefor
US-2022393424-A1 · Dec 8, 2022 · US
Joined body production method and joined body production device
US-2022314594-A1 · Oct 6, 2022 · US
Joining method for optical part
US-11365146-B2 · Jun 21, 2022 · US
Electronic device housing, manufacturing method thereof, and electronic device
US-2022104376-A1 · Mar 31, 2022 · US
Electronic device housing, electronic device, and compound body
US-2021400831-A1 · Dec 23, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B37/045?
- CPC C04B37/045 is the Cooperative Patent Classification code for “characterised by the interlayer used (C04B37/047 takes precedence).”
- How many patents are filed under CPC C04B37/045 (characterised by the interlayer used (C04B37/047 takes precedence))?
- Our database includes 39 publications tagged with this CPC code.
- Is patent activity under CPC C04B37/045 growing?
- Publication counts under this code: 6 in 2024 vs 2 in 2025 (latest complete years).