Electronic device housing, electronic device, and compound body

Patent metadata

Field	Value
Publication number	US-12075583-B2
Application number	US-201917281189-A
Country	US
Kind code	B2
Filing date	May 16, 2019
Priority date	Sep 30, 2018
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.

First claim

What is claimed is:

1. An electronic device housing, comprising:
a frame;
a sealing layer, disposed on at least a part of an outer surface of the frame, and comprising a plurality of sub-sealing layers laminated in sequence; and
a back case, attached to the frame by the sealing layer,
wherein thermal expansion coefficients of the sub-sealing layers increase or decrease along a direction from the frame to the back case, each of the sub-sealing layers is formed with a material comprising a glass powder and a binder, a weight ratio of the glass powder to the binder is 88-92:8-12, and glass powders in two adjacent sub-sealing layers of the sub-sealing layers have different compositions.

2. The electronic device housing according to claim 1 , wherein a thermal expansion coefficient of the sealing layer is smaller than one of a thermal expansion coefficient of the frame and a thermal expansion coefficient of the back case and is greater than the other one of the thermal expansion coefficient of the frame and the thermal expansion coefficient of the back case, a difference between the thermal expansion coefficient of the frame and the thermal expansion coefficient of the sealing layer is no more than 10% of the thermal expansion coefficient of the sealing layer, or a difference between the thermal expansion coefficient of the sealing layer and the thermal expansion coefficient of the back case is no more than 10% of the thermal expansion coefficient of the back case.

3. The electronic device housing according to claim 1 , wherein the frame is a metal frame, and the back case is an inorganic back case; and wherein a bonding promotion layer is further disposed between the metal frame and the sealing layer.

4. The electronic device housing according to claim 3 , wherein the bonding promotion layer meets at least one of the following:
the bonding promotion layer and the sealing layer are similar and compatible;
a surface of the bonding promotion layer away from the metal frame is provided with a concave-convex structure;
the bonding promotion layer has a porous structure;
the bonding promotion layer comprises M or M x O n , wherein M is at least one selected from Fe, Al, Ti, Ni and Mo, x is 1, 2 or 3, and n is an integer from 1 to 6; and
the bonding promotion layer has a thickness of 1-10 μm.

5. The electronic device housing according to claim 3 , wherein a material forming the metal frame comprises stainless steel or aluminum alloy; and a material forming the inorganic back case comprises glass or ceramic.

6. The electronic device housing according to claim 1 , wherein the frame is a ceramic frame, and the back case is a glass back case.

7. The electronic device housing according to claim 1 , wherein the glass powder meets at least one of the following:
the glass powder is free of lead; and
the glass powder comprises at least one of a silicate oxide-based glass powder, a phosphate-based glass powder, a borate-based glass powder, a sulfide-based glass powder, and a halide-based glass powder.

8. An electronic device, comprising an electronic device housing according to claim 1 .

9. A compound body, comprising:
a first workpiece;
a sealing layer, disposed on at least a part of an outer surface of the first workpiece, and comprising a plurality of sub-sealing layers laminated in sequence; and
a second workpiece, attached to the first workpiece by the sealing layer, wherein thermal expansion coefficients of the sub-sealing layers increase or decrease along a direction from the first workpiece to the second workpiece, each of the sub-sealing layers is formed with a material comprising a glass powder and a binder, a weight ratio of the glass powder to the binder is 88-92:8-12, and glass powders in two adjacent sub-sealing layers of the sub-sealing layers have different compositions.

10. The compound body according to claim 9 , wherein a thermal expansion coefficient of the sealing layer is between a thermal expansion coefficient of the first workpiece and a thermal expansion coefficient of the second workpiece, and a difference between the thermal expansion coefficient of the first workpiece and the thermal expansion coefficient of the sealing layer is within ±10% of the thermal expansion coefficient of the sealing layer, or a difference between the thermal expansion coefficient of the sealing layer and the thermal expansion coefficient of the second workpiece is within ±10% of the thermal expansion coefficient of the second workpiece.

11. The compound body according to claim 9 , wherein the first workpiece is a metal piece, and the second workpiece is an inorganic piece, and wherein a bonding promotion layer is further disposed between the metal piece and the sealing layer.

12. The compound body according to claim 11 , wherein the bonding promotion layer meets at least one of the following:
the bonding promotion layer and the sealing layer are similar and compatible;
a surface of the bonding promotion layer away from the metal piece is provided with a concave-convex structure;
the bonding promotion layer has a porous structure;
the bonding promotion layer comprises M or M x O n , wherein M is at least one selected from Fe, Al, Ti, Ni and Mo, x is 1, 2 or 3, and n is an integer from 1 to 6; and
the bonding promotion layer has a thickness of 1-10 μm.

13. The compound body according to claim 11 , wherein a material forming the metal piece comprises stainless steel or aluminum alloy; and a material forming the inorganic piece comprises glass or ceramic.

14. The compound body according to claim 9 , wherein the first workpiece is a ceramic piece, and the second workpiece is a glass piece.

15. The compound body according to claim 9 , wherein the glass powder meets at least one of the following:
the glass powder is free of lead; and
the glass powder comprises at least one of a silicate oxide-based glass powder, a phosphate-based glass powder, a borate-based glass powder, a sulfide-based glass powder, and a halide-based glass powder.

Assignees

• Byd Co Ltd

Inventors

• Ma Lan
• Jin Haiyan
• Pan Ling
• Yu Na
• Chen Liang

Classifications

• H05K5/0217 Primary

  Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• C04B2237/343

  Alumina or aluminates · CPC title

• C04B2237/10

  Glass interlayers, e.g. frit or flux · CPC title

• C04B37/045

  characterised by the interlayer used (C04B37/047 takes precedence) · CPC title