Electronic device housing and electronic device including the same

Patent metadata

Field	Value
Publication number	US-11974405-B2
Application number	US-202217889898-A
Country	US
Kind code	B2
Filing date	Aug 17, 2022
Priority date	Aug 30, 2021
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

An electronic device housing, and an electronic device including the same are provided. The electronic device housing includes a substrate including glass, an insert portion which is bonded to the substrate at a surface of the insert portion, and at which a functional component of an electronic device having the electronic device housing is disposed, and an elastic layer which is between the substrate and the insert portion and extends along the surface of the insert portion.

First claim

What is claimed is:

1. An electronic device housing comprising:
a substrate comprising glass;
an insert portion which is bonded to the substrate at a surface of the insert portion, and at which a functional component of an electronic device having the electronic device housing is disposed;
the insert portion comprising a surface facing the substrate and at which the insert portion is bonded to the substrate; and
an elastic layer which is between the substrate and the surface of the insert portion and extends along the surface of the insert portion, wherein a difference between a coefficient of expansion of the substrate and a coefficient of expansion of the insert portion is greater than or equal to about 10×10 −6 m/(m° C.).

2. The electronic device housing of claim 1 , wherein the glass has a softening temperature of about 750 degrees Celsius or less.

3. The electronic device housing of claim 1 , wherein the substrate comprises about 5 weight percent to about 35 weight percent of Al 2 O 3 , Li 2 O, Na 2 O or B 2 O 3 .

4. The electronic device housing of claim 1 , wherein the insert portion which is coupled to the substrate, comprises a metal or a ceramic.

5. The electronic device housing of claim 1 , wherein a coefficient of expansion of the substrate is about 0.4 times to about 0.8 times a coefficient of expansion of the insert portion which is coupled to the substrate.

6. The electronic device housing of claim 1 , wherein the substrate and the insert portion are spaced apart from each other by the elastic layer.

7. The electronic device housing of claim 1 , further comprising:
an adhesive layer between the substrate and the elastic layer,
wherein the adhesive layer has a glass transition temperature of about 370 degrees Celsius to about 700 degrees Celsius.

8. The electronic device housing of claim 1 , wherein the surface of the insert portion at which the insert portion is coupled to the substrate has an uneven portion, and the elastic layer has an uneven portion corresponding to the uneven portion of the insert portion.

9. The electronic device housing of claim 1 , wherein the surface of the insert portion at which the insert portion is coupled to the substrate is a curved surface, and the elastic layer has a curved surface corresponding to the curved surface of the insert portion.

10. The electronic device housing of claim 1 , wherein the elastic layer comprises silicon or ceramic fiber.

11. The electronic device housing of claim 1 , wherein
the elastic layer comprises a heat-resistant layer, and
the heat-resistant layer comprises TaC or SiC.

12. The electronic device housing of claim 1 , wherein the elastic layer has a melting point of about 1500 degrees Celsius or greater and an elastic modulus of about 200 gigapascals or greater.

13. The electronic device housing of claim 1 , wherein
the substrate defines an opening extended through a thickness of the substrate, and
the insert portion is in the opening, to penetrate the thickness of the substrate.

14. The electronic device housing of claim 1 , wherein the surface of the insert portion along which the elastic layer extends, has an average surface roughness (Ra) of about 0.1 micrometer to about 20 micrometers.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Moon Youngmin
• Bae Jaehyun
• Choi Hyunsuk

Classifications

• H04M1/0264

  for a camera module assembly · CPC title

• H04M1/0283

  for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate · CPC title

• G06F1/1686

  the I/O peripheral being an integrated camera · CPC title

• H05K5/02 Primary

  Details · CPC title

• B32B1/00

  Layered products having a non-planar shape · CPC title