Bonding process for forming semiconductor device structure
US-2025187907-A1 · Jun 12, 2025 · US
Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C3/005 |
| Official title | {Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces} |
| Display label | Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces |
| Total patents | 58 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 6 |
| 2017 | 4 |
| 2018 | 10 |
| 2019 | 9 |
| 2020 | 6 |
| 2021 | 4 |
| 2022 | 4 |
| 2023 | 2 |
| 2024 | 3 |
| 2025 | 4 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2025187907-A1 · Jun 12, 2025 · US
US-2025162860-A1 · May 22, 2025 · US
US-12258265-B2 · Mar 25, 2025 · US
US-2025011160-A1 · Jan 9, 2025 · US
US-2024425367-A1 · Dec 26, 2024 · US
US-12122666-B2 · Oct 22, 2024 · US
US-11927916-B2 · Mar 12, 2024 · US
US-2023365402-A1 · Nov 16, 2023 · US
US-11772963-B2 · Oct 3, 2023 · US
US-11485632-B2 · Nov 1, 2022 · US
US-2022289559-A1 · Sep 15, 2022 · US
US-11369345-B2 · Jun 28, 2022 · US
US-2022063993-A1 · Mar 3, 2022 · US
US-11192778-B2 · Dec 7, 2021 · US
US-11174156-B2 · Nov 16, 2021 · US
US-11084718-B2 · Aug 10, 2021 · US
US-10971468-B2 · Apr 6, 2021 · US
US-2020339413-A1 · Oct 29, 2020 · US
US-2020292991-A1 · Sep 17, 2020 · US
US-2020223689-A1 · Jul 16, 2020 · US
Answers are generated from the same data shown on this page.