A microfluidic sensor
US-2023404777-A1 · Dec 21, 2023 · US
Moulding
Moulding · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C2201/034 |
| Official title | Moulding |
| Display label | Moulding |
| Total patents | 81 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 4 |
| 2017 | 4 |
| 2018 | 6 |
| 2019 | 10 |
| 2020 | 11 |
| 2021 | 10 |
| 2022 | 7 |
| 2023 | 11 |
| 2024 | 6 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wearable device with fluid-based circuits and stretch-sensitive materials, and systems including the wearable device used in conjunction with a virtual-reality headset
US-11640206-B1 · May 2, 2023 · US
Microfluidic chip and microfluidic device
US-11478790-B2 · Oct 25, 2022 · US
Method for producing damper structures on a micromechanical wafer
US-11472698-B2 · Oct 18, 2022 · US
Digital microfluidics device with droplet processing components
US-2022250077-A1 · Aug 11, 2022 · US
Semiconductor devices and related methods
US-11383970-B2 · Jul 12, 2022 · US
Wearable gloves including a fabric material worn by a user, a position sensor, and a matrix with a plurality of voids that each include at least one fluidic actuator
US-2022187920-A1 · Jun 16, 2022 · US
Microfluidic cell culture devices
US-2022105510-A1 · Apr 7, 2022 · US
Preparation method of bionic adhesive material with tip-expanded microstructural array
US-11254566-B2 · Feb 22, 2022 · US
Method for producing damper structures on a micromechanical wafer
US-2021323810-A1 · Oct 21, 2021 · US
Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces
US-11148943-B2 · Oct 19, 2021 · US
Method for producing fine, hollow projection tool
US-11123530-B2 · Sep 21, 2021 · US
Polymer surface with t-shaped microstructure and fabrication method therefor and applications thereof
US-11110415-B2 · Sep 7, 2021 · US
Preparation method of bionic adhesive material with tip-expanded microstructural array
US-2021261405-A1 · Aug 26, 2021 · US
Microfluidic devices and associated methods
US-2021221676-A1 · Jul 22, 2021 · US
Method of fabricating a timepiece component and component obtained from this method
US-2021191338-A1 · Jun 24, 2021 · US
Semiconductor module
US-11040872-B2 · Jun 22, 2021 · US
Methods for manufacturing micromechanical components and method for manufacturing a mould insert component
US-2021171340-A1 · Jun 10, 2021 · US
Semiconductor devices and related methods
US-2021009406-A1 · Jan 14, 2021 · US
Dry adhesives and methods for making dry adhesives
US-10774246-B2 · Sep 15, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C2201/034?
- CPC B81C2201/034 is the Cooperative Patent Classification code for “Moulding.”
- How many patents are filed under CPC B81C2201/034 (Moulding)?
- Our database includes 81 publications tagged with this CPC code.
- Is patent activity under CPC B81C2201/034 growing?
- Publication counts under this code: 6 in 2024 vs 5 in 2025 (latest complete years).