Method for manufacturing MEMS microphone
US-11405737-B2 · Aug 2, 2022 · US
Passivation
Passivation · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C2201/016 |
| Official title | Passivation |
| Display label | Passivation |
| Total patents | 94 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 8 |
| 2017 | 9 |
| 2018 | 7 |
| 2019 | 12 |
| 2020 | 10 |
| 2021 | 4 |
| 2022 | 7 |
| 2023 | 11 |
| 2024 | 5 |
| 2025 | 15 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Stacked-die MEMS resonator
US-11370656-B2 · Jun 28, 2022 · US
Addressable vertical nanowire probe arrays and fabrication methods
US-11363979-B2 · Jun 21, 2022 · US
Production method for a micromechanical component
US-2022081285-A1 · Mar 17, 2022 · US
Fence structure to prevent stiction in a MEMS motion sensor
US-11261083-B2 · Mar 1, 2022 · US
Method and Structure for Sensors on Glass
US-2022009771-A1 · Jan 13, 2022 · US
Semiconductor device and method of producing a semiconductor device
US-11167981-B2 · Nov 9, 2021 · US
Stacked-die mems resonator
US-2021179421-A1 · Jun 17, 2021 · US
Substrate assembly and related methods
US-11008214-B2 · May 18, 2021 · US
Manufacturing of integrated circuit resonator
US-10913655-B2 · Feb 9, 2021 · US
Low-profile stacked-die mems resonator system
US-2020385261-A1 · Dec 10, 2020 · US
Package structure for micromechanical resonator
US-10723617-B2 · Jul 28, 2020 · US
Method for Manufacturing MEMS Microphone
US-2020213797-A1 · Jul 2, 2020 · US
Mems device having a tiltable suspended structure controlled by electromagnetic actuation
US-2020192081-A1 · Jun 18, 2020 · US
Capacitive micro structure
US-2020180943-A1 · Jun 11, 2020 · US
Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head
US-10661566-B2 · May 26, 2020 · US
Fence structure to prevent stiction in a mems motion sensor
US-2020140265-A1 · May 7, 2020 · US
Anti-wetting coating for Si-based MEMS fluidic device, and method of application of same
US-10626013-B2 · Apr 21, 2020 · US
Semiconductor device and method of producing a semiconductor device
US-2020062586-A1 · Feb 27, 2020 · US
Fence structure to prevent stiction in a MEMS motion sensor
US-10562763-B2 · Feb 18, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C2201/016?
- CPC B81C2201/016 is the Cooperative Patent Classification code for “Passivation.”
- How many patents are filed under CPC B81C2201/016 (Passivation)?
- Our database includes 94 publications tagged with this CPC code.
- Is patent activity under CPC B81C2201/016 growing?
- Publication counts under this code: 5 in 2024 vs 15 in 2025 (latest complete years).