Actuator layer patterning with topography
US-10745270-B2 · Aug 18, 2020 · US
Mask characterised by its composition, e.g. multilayer masks
Mask characterised by its composition, e.g. multilayer masks · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C1/00396 |
| Official title | {Mask characterised by its composition, e.g. multilayer masks} |
| Display label | Mask characterised by its composition, e.g. multilayer masks |
| Total patents | 89 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 18 |
| 2017 | 10 |
| 2018 | 5 |
| 2019 | 8 |
| 2020 | 7 |
| 2021 | 3 |
| 2022 | 3 |
| 2023 | 7 |
| 2024 | 3 |
| 2025 | 8 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Actuator layer patterning with topography
US-2020131031-A1 · Apr 30, 2020 · US
Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film
US-10599034-B2 · Mar 24, 2020 · US
Method of etching microelectronic mechanical system features in a silicon wafer
US-2019333773-A1 · Oct 31, 2019 · US
Method of etching microelectronic mechanical system features in a silicon wafer
US-2019287810-A1 · Sep 19, 2019 · US
Methods for providing lithography features on a substrate by self-assembly of block copolymers
US-10410914-B2 · Sep 10, 2019 · US
Electrically conductive patterns with wide line-width and methods for producing same
US-10399851-B2 · Sep 3, 2019 · US
Method of etching microelectronic mechanical system features in a silicon wafer
US-10395940-B1 · Aug 27, 2019 · US
Fence structure to prevent stiction in a mems motion sensor
US-2019062153-A1 · Feb 28, 2019 · US
Method for manufacturing mems devices using multiple photoacid generators in a composite photoimageable dry film
US-2019056659-A1 · Feb 21, 2019 · US
Method for manufacturing mems devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film
US-2019056660-A1 · Feb 21, 2019 · US
Dielectric cladding of microelectromechanical systems (MEMS) elements for improved reliability
US-10029908-B1 · Jul 24, 2018 · US
Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film
US-10031415-B1 · Jul 24, 2018 · US
Dielectric cladding of microelectromechanical systems (mems) elements for improved reliability
US-2018186625-A1 · Jul 5, 2018 · US
Neutral hard mask and its application to graphoepitaxy-based directed self-assembly (DSA) patterning
US-9881793-B2 · Jan 30, 2018 · US
Semiconductor device
US-9875965-B2 · Jan 23, 2018 · US
Graphoepitaxy directed self assembly
US-9810980-B1 · Nov 7, 2017 · US
Wafer level packaging of mems
US-2017217759-A1 · Aug 3, 2017 · US
Electrically conductive patterns with wide line-width and methods for producing same
US-2017217768-A1 · Aug 3, 2017 · US
Methods for providing lithography features on a substrate by self-assembly of block copolymers
US-2017200638-A1 · Jul 13, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C1/00396?
- CPC B81C1/00396 is the Cooperative Patent Classification code for “Mask characterised by its composition, e.g. multilayer masks.”
- How many patents are filed under CPC B81C1/00396 (Mask characterised by its composition, e.g. multilayer masks)?
- Our database includes 89 publications tagged with this CPC code.
- Is patent activity under CPC B81C1/00396 growing?
- Publication counts under this code: 3 in 2024 vs 8 in 2025 (latest complete years).