Method and device for wire cutting of a material

Patent metadata

Field	Value
Publication number	US-2016243725-A1
Application number	US-201415023902-A
Country	US
Kind code	A1
Filing date	Sep 23, 2014
Priority date	Sep 24, 2013
Publication date	Aug 25, 2016
Grant date	—

Abstract

The invention relates to a method for wire cutting of a material, wherein a cutting wire is advanced into the material by causing said wire to scroll in such a way as to progressively cut the material, the method being characterised in that it comprises: the measurement of a force applied by the wire on the material as a function of time, the measurement of the advancement of the wire in the material as a function of time, the determination, as a function of said force and said advancement of the wire, of a variable characterising the state of the wire cutting and, servo control of at least one cutting parameter through changes in said variable so as to reduce the rate of wear of the wire and/or to reduce the risk of breaking of the wire. The invention also relates to a device for wire cutting allowing implementation of said method.

First claim

1 . A method for wire cutting a material, in which a cutting wire is advanced in said material by causing said wire to run so as to gradually cut the material, the method comprising:
measuring a force applied by the wire on said material versus time, measuring the advance of the wire in said material versus time, determining, from said force and from said advance of the wire, a quantity characterizing the wire cutting condition, and servo-controlling at least one cutting parameter to the time-dependent change of said quantity so as to decrease the wearing rate of the wire and/or reducing the risk of breaking the wire.

2 . The method according to claim 1 , wherein the advance of the wire is determined by the ratio da/dt, wherein a is the position of the wire with respect to one of the edges of the material versus time.

3 . The method according to claim 2 , wherein the quantity characterizing the cutting condition fits the following formula:

EF
=

L
Fu




a


t

wherein:
L is the width of the material to be cut,
F is the measured force,
u is the running speed of the wire.

4 . The method according to claim 3 , wherein the advance of the wire is given by the formula:


a


t

=

V
-



y
0


t

wherein V is the velocity of a kinematic wire guiding system with respect to the material and y 0 is the difference in position of the wire on an edge of the material with respect to said kinematic wire guiding system.

5 . The method according to claim 1 , wherein the advance of the wire is determined by the surface generation rate dS/dt, wherein S is the surface generated by the cutting in the material over time.

6 . The method according to claim 5 , wherein the quantity characterizing the cutting condition fits the following formula:

EF
=

L
Fu




S


t

wherein:
F is the measured force,
u is the running speed of the wire.

7 . The method according to claim 6 , wherein the advance of the wire is given by the formula:


S


t

=

LV
-

L




y
0


t



(

1
+

L

6



l

)

Wherein:
y o is the deflection of the wire on the edge of the material in the reference system of the kinematic wire guiding system,
L is the width of the material,
l is the distance in a direction parallel to the wire between the edge of the material and the centre of rotation of the pulleys.

8 . The method according to claim 1 , wherein the material is a semi-conducting material such as silicon and/or sapphire.

9 . The method according to claim 1 , wherein the cutting wire is a wire with a bound abrasive.

10 . The method according to claim 1 , wherein said at least one cutting parameter servo-controlled to the time-dependent change of said quantity characterizing the cutting condition is selected from the running speed of the wire, the advance velocity of the wire in the material and the renewal of the wire.

11 . The method according to claim 10 , further comprising servo-control of the distribution flow rate of a lubricant, of the tension of the wire and/or of the acceleration of the wire to the time-dependent change of said quantity characterizing the cutting condition.

12 . The method according to claim 3 , wherein if the measured quantity becomes less than a predetermined threshold, the presence of a region with greater abrasion resistance is detected in the material and the servo-control comprises the reduction in the advance speed and/or the increase in the running speed of the wire as long as the measured quantity remains below said threshold.

13 . The method according to claim 3 , wherein if the measured quantity becomes greater than a predetermined upper limit, the presence of a region with lower abrasion resistance is detected in the material and the servo-control comprises the increase in the advance speed as long as the quantity remains above said threshold.

14 . The method according to claim 1 , wherein the cutting wire is smooth and the abrasion is achieved by a cutting mixture comprising abrasive grains dispersed in a liquid, said mixture being dispensed between the wire and the material to be cut.

15 . The method according to claim 14 , wherein said at least one servo-controlled cutting parameter is selected from among the flow rate and/or the renewal rate of the cutting mixture.

16 . The method according to claim 15 , further comprising servo-control of the running speed of the wire, of the advance speed of the wire and/or the tension of the wire to the time-dependent change in said quantity characterizing the cutting condition.

17 . A device for wire cutting a material, comprising:
a support for said material, at least one cutting wire, a kinematic system for guiding the wire, comprising at least two pulleys laid out for guiding said wire-during the cutting of the material, a suitable control system

Assignees

• Commissariat Energie Atomique

Inventors

• Sillard Léo
• Garandet Jean-Paul
• Penot Jean-Daniel

Classifications

• B28D5/0064 Primary

  Devices for the automatic drive or the program control of the machines · CPC title

• G05B2219/50331

  Electrode, wire gap compensation in edm, wire cutting · CPC title

• B28D5/045

  by cutting with wires or closed-loop blades (B28D5/042 takes precedence) · CPC title

• G05B19/418

  Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] · CPC title

• G05B2219/45031

  Manufacturing semiconductor wafers · CPC title