Minimally invasive microsampler for intact removal of surface deposits and substrates
US-12360016-B2 · Jul 15, 2025 · US
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by drilling
by drilling · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D5/021 |
| Official title | {by drilling} |
| Display label | by drilling |
| Total patents | 16 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 2 |
| 2017 | 1 |
| 2018 | 2 |
| 2019 | 3 |
| 2020 | 1 |
| 2021 | 1 |
| 2022 | 1 |
| 2023 | 3 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Minimally invasive microsampler for intact removal of surface deposits and substrates
US-2023221215-A1 · Jul 13, 2023 · US
Method for machining synthetic quartz glass substrate
US-11673385-B2 · Jun 13, 2023 · US
Minimally invasive microsampler for intact removal of surface deposits and substrates
US-11573156-B2 · Feb 7, 2023 · US
Method for machining synthetic quartz glass substrate
US-2022126558-A1 · Apr 28, 2022 · US
Mechanical seed coupling
US-10968934-B2 · Apr 6, 2021 · US
Minimally invasive microsampler for intact removal of surface deposits and substrates
US-2020225122-A1 · Jul 16, 2020 · US
Core drill bit and methods of forming the same
US-2019329449-A1 · Oct 31, 2019 · US
Method of manufacturing small-diameter wafer
US-2019148132-A1 · May 16, 2019 · US
Semiconductor substrate manufacturing method
US-10253432-B2 · Apr 9, 2019 · US
Mechanical seed coupling
US-2018080487-A1 · Mar 22, 2018 · US
Mechanical seed coupling
US-9863453-B2 · Jan 9, 2018 · US
Semiconductor substrate manufacturing method
US-2017009378-A1 · Jan 12, 2017 · US
Method for producing a quartz-glass hollow cylinder
US-9481108-B2 · Nov 1, 2016 · US
Ductile mode drilling methods for brittle components of plasma processing apparatuses
US-9314854-B2 · Apr 19, 2016 · US
Method for producing a quartz-glass hollow cylinder
US-2015078846-A1 · Mar 19, 2015 · US