Method for machining synthetic quartz glass substrate

Patent metadata

Field	Value
Publication number	US-11673385-B2
Application number	US-202117494262-A
Country	US
Kind code	B2
Filing date	Oct 5, 2021
Priority date	Oct 27, 2020
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

A synthetic quartz glass substrate is machined by bringing a surface of the synthetic quartz glass substrate as the workpiece into contact with and superposing it on a surface of a protective member made of synthetic quartz glass to effect optical contact bonding of the workpiece and the protective member, and passing a cutting tool through the optical contact bonding surfaces. This machining process is able to effectively prevent the generation of microdefects at the cutting tool entry site and extraction site during a cutting operation. Moreover, a fixing agent is not used to join the workpiece and the protective member, and so productivity is high because there is no need for the application and later removal of a fixing agent.

First claim

The invention claimed is:

1. A method for machining a synthetic quartz glass substrate, comprising the steps of:
furnishing a synthetic quartz glass substrate as a workpiece;
furnishing a protective member for protecting the workpiece, the protective member made of synthetic quartz glass;
optical contact bonding the workpiece and the protective member by bringing a surface of the protective member into contact with and superposing a surface of the protective member on a surface of the workpiece, so that an optical contact bonding surface is formed between the workpiece and the protective member; and
cutting the synthetic quartz glass substrate by passing a cutting tool i) from a protective member side and through the optical contact bonding surface to a synthetic quartz glass substrate side, thereby forming a through-hole or a slit in the protective member, or ii) both from the protective member side and through the optical contact bonding surface to the synthetic quartz glass substrate side, thereby forming a through-hole or a slit in the protective member, and also from the synthetic quartz glass substrate side and through the optical contact bonding surface to the protective member side.

2. The machining method of claim 1 , wherein the surface of the synthetic quartz glass substrate and the surface of the protective member, which form the optical contact bonding surface together, each have an arithmetic mean roughness (Ra) of 1 nm or less.

3. The machining method of claim 1 , wherein in the cutting step, a blind hole, a channel or a step is formed in the synthetic quartz glass substrate.

4. The machining method of claim 1 , wherein in the cutting step, a through-hole or a slit is formed in the synthetic quartz glass substrate.

5. The machining method of claim 1 , wherein the protective member has a thickness of at least 0.2 mm.

6. A method for machining synthetic quartz glass substrates, comprising the steps of:
furnishing a plurality of synthetic quartz glass substrates;
optical contact bonding the plurality of synthetic quartz glass substrates by mutually contacting and superposing surfaces of the respective synthetic quartz glass substrates to give a workpiece, so that an optical contact bonding surface is formed between the synthetic quartz glass substrates;
furnishing a first protective member and a second protective member for protecting the workpiece, each of the first and second protective members made of synthetic quartz glass;
optical contact bonding the workpiece and the first and second protective members by i) bringing a surface of the first protective member into contact with and superposing the surface of the first protective member on a surface of the workpiece, and ii) by bringing a surface of the second protective member into contact with and superposing the surface of the second protective member on another surface of the workpiece, so that the workpiece is sandwiched between the first and second protective members and optical contact bonding surfaces are formed between the workpiece and the first and second protective members; and
cutting the synthetic quartz glass substrates by passing a cutting tool i) from a first protective member side and through the optical contact bonding surfaces thereof to a workpiece side at the synthetic quartz glass substrate spaced furthest from the first protective member, thereby forming a through-hole or a slit in the first protective member, or ii) from a second protective member side and through the optical contact bonding surfaces thereof to a workpiece side at the synthetic quartz glass substrate spaced furthest from the second protective member thereby forming a through-hole or a slit in the second protective member.

7. The machining method of claim 6 , wherein the surfaces of the synthetic quartz glass substrates, which contact with each other, in the workpiece, the surfaces of the workpiece contacting with the first and second protective members, and the surfaces of the first and second protective members contacting with the workpiece, each have an arithmetic mean roughness (Ra) of 1 nm or less.

8. The machining method of claim 6 , wherein in the cutting step, a through-hole or a slit is formed in each of the synthetic quartz glass substrates.

9. The machining method of claim 8 , wherein in the cutting step, a through-hole or a slit is formed in each of the first and second protective members and the synthetic quartz glass substrates.

10. The machining method of claim 6 , wherein each of the protective members has a thickness of at least 0.2 mm.

11. A method for machining a synthetic quartz glass substrate, comprising the steps of:
furnishing a synthetic quartz glass substrate as a workpiece;
furnishing a protective member for protecting the workpiece, the protective member made of synthetic quartz glass;
optical contact bonding the workpiece and the protective member by bringing a surface of the protective member into contact with and superposing a surface of the protective member on a surface of the workpiece, so that an optical contact bonding surface is formed between the workpiece and the protective member; and
cutting the synthetic quartz glass substrate by passing a cutting tool from the synthetic quartz glass substrate side and through the optical contact bonding surface to the protective member side to form a through-hole or a slit in the protective member and the synthetic quartz glass substrate.

12. The machining method of claim 11 , wherein the surface of the synthetic quartz glass substrate and the surface of the protective member, which form the optical contact bonding surface together, each have an arithmetic mean roughness (Ra) of 1 nm or less.

Assignees

• Shinetsu Chemical Co

Inventors

• Ando Masao
• Yamazaki Hiroyuki

Classifications

• C03B40/00 Primary

  Preventing adhesion between glass and glass or between glass and the means used to shape it {, hold it or support it} · CPC title

• B32B17/10005

  laminated safety glass or glazing · CPC title

• Y02P40/57

  Improving the yield, e-g- reduction of reject rates · CPC title

• B28D5/021

  by drilling · CPC title

• B32B3/266

  characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title