Polishing head management system and method
US-2022324077-A1 · Oct 13, 2022 · US
for grinding inorganic material, e.g. stone, ceramics, porcelain
for grinding inorganic material, e.g. stone, ceramics, porcelain · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B7/22 |
| Official title | for grinding inorganic material, e.g. stone, ceramics, porcelain |
| Display label | for grinding inorganic material, e.g. stone, ceramics, porcelain |
| Total patents | 96 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 5 |
| 2017 | 7 |
| 2018 | 7 |
| 2019 | 7 |
| 2020 | 12 |
| 2021 | 12 |
| 2022 | 11 |
| 2023 | 12 |
| 2024 | 10 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Grinding apparatus
US-2022143781-A1 · May 12, 2022 · US
Semiconductor wafer photoelectrochemical mechanical polishing processing device and processing method
US-2022088740-A1 · Mar 24, 2022 · US
Annular grindstone
US-11229986-B2 · Jan 25, 2022 · US
Cutting tool and method for manufacturing optical fiber preform
US-2022011499-A1 · Jan 13, 2022 · US
Flexible sanding device for cylinder rock specimen
US-11203095-B2 · Dec 21, 2021 · US
Substrate-cleaning apparatus having tiltable roll brush
US-2021362198-A1 · Nov 25, 2021 · US
Grinding apparatus
US-2021347009-A1 · Nov 11, 2021 · US
Double row abrasive disc
US-11161215-B2 · Nov 2, 2021 · US
Processing apparatus
US-2021252661-A1 · Aug 19, 2021 · US
Method of using polishing or grinding pad assembly
US-11084140-B2 · Aug 10, 2021 · US
Method of using polishing or grinding pad assembly
US-2021205942-A1 · Jul 8, 2021 · US
Workpiece processing method
US-11040427-B2 · Jun 22, 2021 · US
Polishing pad that minimizes occurrence of defects and process for preparing the same
US-11000935-B2 · May 11, 2021 · US
Method of grinding substrate
US-2021101252-A1 · Apr 8, 2021 · US
System, device and method for reconditioning a substrate support
US-2021053177-A1 · Feb 25, 2021 · US
SEED CRYSTAL FOR SINGLE CRYSTAL 4H-SiC GROWTH AND METHOD FOR PROCESSING THE SAME
US-2021047750-A1 · Feb 18, 2021 · US
Slab cutting apparatus and method
US-10864656-B2 · Dec 15, 2020 · US
Stone slab manufacturing methods and systems
US-2020311906-A1 · Oct 1, 2020 · US
Polishing pad that minimizes occurrence of defects and process for preparing the same
US-2020306921-A1 · Oct 1, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B7/22?
- CPC B24B7/22 is the Cooperative Patent Classification code for “for grinding inorganic material, e.g. stone, ceramics, porcelain.”
- How many patents are filed under CPC B24B7/22 (for grinding inorganic material, e.g. stone, ceramics, porcelain)?
- Our database includes 96 publications tagged with this CPC code.
- Is patent activity under CPC B24B7/22 growing?
- Publication counts under this code: 10 in 2024 vs 8 in 2025 (latest complete years).