Method of using polishing or grinding pad assembly

US11084140B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11084140-B2
Application numberUS-201916718641-A
CountryUS
Kind codeB2
Filing dateDec 18, 2019
Priority dateSep 24, 2015
Publication dateAug 10, 2021
Grant dateAug 10, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.

First claim

Opening claim text (preview).

The invention claimed is: 1. A pad assembly comprising: a fibrous pad comprising an upper surface, a floor-facing lower surface, and a peripheral surface; a reinforcement layer; and abrasive tools, wherein the reinforcement layer is attached to the floor-facing lower surface of the fibrous pad, the reinforcement layer including an internal edge defining a hole therethrough; wherein the abrasive tools are attached to a floor-facing surface of the reinforcement layer; wherein a central area of the fibrous pad is exposed through the hole of the reinforcement layer; wherein the abrasive tools are disks; and wherein each of the disks has a floor-contacting nominal surface which is angularly offset by at least two degrees relative to the floor-facing surface of the reinforcement layer. 2. The pad assembly according to claim 1 , wherein the fibrous pad is flexible. 3. The pad assembly according to claim 1 , wherein the reinforcement layer is elastomeric or polymeric. 4. The pad assembly according to claim 1 , wherein the reinforcement layer has a thickness up to 0.125 inches. 5. The pad assembly according to claim 1 , wherein the fibrous pad includes diamond abrasive particles and has thickness of about 1 inch. 6. The pad assembly according to claim 1 , wherein a thickness of the reinforcement layer is less than a thickness of the fibrous pad. 7. The pad assembly according to claim 1 , wherein the reinforcement layer has a wavy or undulating inner edge relative to a circular outer peripheral edge of the reinforcement layer. 8. The pad assembly according to claim 1 , wherein the inner edge of the reinforcement layer has peaks with less radial distance from a center of the floor-facing surface of the fibrous pad than valleys formed between adjacent peaks. 9. The pad assembly according to claim 1 , wherein the inner edge of the reinforcement layer is circular. 10. The pad assembly according to claim 1 , wherein a periphery of the reinforcement layer is circular. 11. The pad assembly according to claim 1 , wherein the abrasive tools are adhesively bonded to the reinforcement layer and substantially equally spaced away from a centerline of the fibrous pad. 12. The pad assembly according to claim 1 , wherein the abrasive tools are disks having a peripheral diameter of about 0.5-2.5 inches. 13. The pad assembly according to claim 1 , wherein the abrasive tools are disks, the disks comprising a first set of disks and a second set of disks coupled to the fibrous pad, each disk of the first set of disks including a floor-contacting nominal surface; and wherein each disk of the second set of disks includes a floor-contacting nominal surface; and wherein a characteristic of the second set of disks are different from that of the first set of disks.

Assignees

Inventors

Classifications

  • B24D13/14Primary

    acting by the front face · CPC title

  • for grinding floorings, walls, ceilings or the like (machines or devices for cleaning floorings A47L11/00, A47L13/00) · CPC title

  • Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title

  • Grinding heads for working on plane surfaces · CPC title

  • Disk shaped surface treating tools · CPC title

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Frequently asked questions

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What does patent US11084140B2 cover?
A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension …
Who is the assignee on this patent?
Husqvarna Ab
What technology area does this patent fall under?
Primary CPC classification B24D13/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).