Workpiece processing method

Patent metadata

Field	Value
Publication number	US-11040427-B2
Application number	US-201514644863-A
Country	US
Kind code	B2
Filing date	Mar 11, 2015
Priority date	Mar 12, 2014
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

A method of processing a workpiece which includes metal in a work surface by a processing unit including a grindstone or a polishing pad includes a processing step of grinding or polishing the workpiece by the processing unit while supplying a processing fluid to the work surface of the workpiece. The processing fluid contains an organic acid and an oxidizing agent.

First claim

What is claimed is:

1. A method of processing a workpiece by a processing means, wherein the workpiece includes metal posts embedded in a work surface thereof,
the processing means including:
a spindle to which a wheel mount is fixed,
a grinding wheel including a plurality of grindstones and mounted on a lower surface of the wheel mount,

the method comprising:
a processing step of grinding the work surface including the metal posts embedded therein by rotating the grinding wheel of the processing means while suppressing ductility of the metal of the metal posts by supplying a processing fluid to the work surface of the workpiece to modify the metal of the metal posts,
wherein the processing fluid contains an organic acid and an oxidizing agent, and
wherein said grinding is performed until the thickness of the workpiece is reduced to a predetermined thickness by rotating the spindle and the workpiece and bringing the grindstones into contact with the work surface of the workpiece while lowering the grinding wheel at a predetermined feed rate.

2. The method of processing according to claim 1 , wherein the processing fluid further contains an anticorrosive.

3. The method of processing according to claim 1 , wherein the workpiece is a disc-shaped WL-CSP substrate.

4. The method of processing according to claim 1 , wherein said grinding is performed by rotating the spindle and the workpiece so as to move the grindstones from the outside to the inside of the work surface.

5. The method of processing according to claim 1 , wherein the rotating speed of the spindle is twenty times greater than the rotating speed of the workpiece.

6. The method of processing according to claim 1 , wherein the rotating speed of the spindle is 6,000 rpm and the rotating speed of the workpiece is 300 rpm.

7. The method of processing according to claim 1 , wherein the rotating speed of the spindle is at least ten times greater than the rotating speed of the workpiece.

8. The method of processing according to claim 1 , wherein the organic acid comprises a compound that includes at least one carboxyl group and at least one amino group in its molecule.

9. The method of processing according to claim 8 , wherein the at least one amino group comprises a secondary amino group.

10. The method of processing according to claim 8 , wherein the at least one amino group comprises a tertiary amino group.

11. The method of processing according to claim 1 , wherein the organic acid includes at least one of the following: L-alanine, L-proline, L-histidine, L-lysine, and dihydroxyethylglycine.

12. The method of processing according to claim 1 , wherein the organic acid is an amino polyacid.

13. The method of processing according to claim 1 , wherein the organic acid includes at least one of the following: iminodiacetic acid, nitrilotriacetic acid, diethylenetriaminepentaacetic acid, ethylenediaminetetraacetic acid, hydroxyethyliminodiacetic acid, nitrilotrismethylenephosphonic acid, ethylenediamine-N,N,N′,N′-tetramethylenephosphonic acid, 1,2-diaminopropanetetraacetic acid, glycol ether diaminetetraacetic acid, transcyclohexanediaminetetraacetic acid, ethylenediamineorthohydroxyphenylacetic acid, ethylenediaminedisuccinic acid (SS isomer), β-alaninediacetic acid, N-(2-carboxylatoethyl)-L-aspartic acid, and N,N′-bis(2-hydroxybenzyl)ethylenediamine-N,N′-diacetic acid.

14. The method of processing according to claim 1 , wherein the organic acid includes at least one of the following: butyric acid, valeric acid, hexanoic acid, glutaric acid, adipic acid, succinic acid, pimelic acid, mercaptoacetic acid, glyoxylic acid, chloroacetic acid, pyruvic acid, acetoacetic acid, and glutaric acid.

15. The method of processing according to claim 1 , wherein the organic acid includes at least one of the following: mesaconic acid and aconitic acid.

16. The method of processing according to claim 1 , wherein the organic acid includes at least one of the following: toluic acid and pyromellitic acid.

17. The method of processing according to claim 1 , wherein the oxidizing agent includes at least one of the following: an iodate, a periodate, a hypochlorite, a chlorite, a chlorate, a perchlorates, a dichromate, permanganate, a cerate, a vanadate, a silver(II) salt, an iron(III) salt, and their organic complex salts.

Assignees

• Disco Corp

Inventors

• Takenouchi Kenji

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• H10P50/00 Primary

  Etching of wafers, substrates or parts of devices · CPC title

• B24B7/22

  for grinding inorganic material, e.g. stone, ceramics, porcelain · CPC title

• B24B7/228 Primary

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• B24B37/044

  characterised by the composition of the lapping agent · CPC title