Workpiece processing apparatus including a resin coater and a resin grinder

Patent metadata

Field	Value
Publication number	US-11819975-B2
Application number	US-201816216291-A
Country	US
Kind code	B2
Filing date	Dec 11, 2018
Priority date	Dec 26, 2017
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.

First claim

What is claimed is:

1. A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having a device formed in each of regions demarcated by a plurality of planned dividing lines, the workpiece processing apparatus comprising:
a cassette including a plurality of shelves formed therewithin and housing a plurality of workpieces, said cassette is mounted on a cassette mounting means;
a spinner table surrounded by a cover and a first conveying means below said cover, said spinner table configured to hold the workpiece;
a second conveying means that transfers the workpiece between the cassette and the spinner table;
a resin coating means configured for coating the front surface of the workpiece with the resin;
a resin curing means including a chamber having an external stimulus, the workpiece on said spinner table being reciprocably movable between said resin coating means and within said chamber of said resin curing means using said first conveying means, said resin curing means curing the resin on the workpiece by applying the external stimulus to the resin on the front surface of the workpiece to provide a cured coated resin on the front surface of the workpiece;
a resin grinding means including a rotating grinding stone that flattens the cured coated resin by grinding a portion of the cured coated resin such that a portion of the cured resin remains on the front surface of the workpiece after grinding;
a thickness measuring means including a chuck table that holds the workpiece with the cured coated resin, wherein the thickness measuring means measures a thickness of the cured coated resin on the workpiece after the cured coated resin is ground by the resin grinding means and provides a measured thickness of the cured coated resin, and transmits the measured thickness of the cured coated resin to a control means;
a grinding apparatus in the next process that grinds a back surface of the workpiece to a predetermined thickness based on the measured thickness of the cured coated resin on the front surface; and
the control means controlling operations of the workpiece processing apparatus, wherein the control means stores a number associated with each of the plurality of shelves within the cassette and the measured thickness value of the cured coated resin of the workpieces housed in each of the plurality of shelves and transmits, the number associated with each of the plurality of shelves within the cassette and the measured thickness value of the cured coated resin of the respective workpiece housed in each of the plurality of shelves to the grinding apparatus.

2. The workpiece processing apparatus according to claim 1 , wherein the resin coating means coats the front surface of the workpiece with the resin by a spin coating method.

3. The workpiece processing apparatus according to claim 1 , wherein said thickness measuring means includes a light projecting element and a light detecting element, said light projecting element directs light at an upper surface of the cured coated resin on the workpiece and through the cured coated resin to a lower surface of the cured coated resin and said light detecting element receives reflected light from the upper surface and the lower surface of the cured coated resin, and said thickness measuring means calculates an optical path difference to determine the thickness of the cured coated resin.

4. The workpiece processing apparatus according to claim 1 , wherein the thickness measuring means includes a first height measuring means that measuring a holding surface of a holding table for the workpiece, and a second height measuring means that measures an upper surface of the cured coated resin on the workpiece.

5. The workpiece processing apparatus according to claim 1 , wherein said first height measuring means and said second height measuring means each include a contact that is raised and lowered relative to the workpiece, wherein the contact of said first height measuring means contacts the holding surface, and the contact of the second height measuring means contacts the upper surface of the cured coated resin.

6. The workpiece processing apparatus according to claim 1 , further comprising a cleaning apparatus configured for cleaning a ground surface of the cured coated resin on the workpiece.

7. The workpiece processing apparatus according to claim 1 , wherein the resin curing means includes a plurality of light sources of ultraviolet light that emit ultraviolet light rays of a predetermined wavelength on the workpiece to provide the cured coated resin on the front surface of the workpiece.

Assignees

• Disco Corp

Inventors

• Watanabe Shinya
• Yamahata Ichiro
• Suzuki Katsuhiko

Classifications

• H10P90/123

  by grinding or lapping · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/3218

  Conveying cassettes, containers or carriers · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title