Acquisition method for S-parameters in microwave introduction modules, and malfunction detection method
US-9702913-B2 · Jul 11, 2017 · US
Workpiece evaluating method
US10157802B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10157802-B2 |
| Application number | US-201715461784-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 17, 2017 |
| Priority date | Mar 28, 2016 |
| Publication date | Dec 18, 2018 |
| Grant date | Dec 18, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A workpiece evaluating method evaluates the gettering property of a device wafer having a plurality of devices formed on the front side of the wafer and having a gettering layer formed inside the wafer. The method includes the steps of applying excitation light for exciting a carrier to the wafer, applying microwaves to a light applied area where the excitation light is applied and also to an area other than the light applied area, measuring the intensity of the microwaves reflected from the light applied area and from the area other than the light applied area, subtracting the intensity of the microwaves reflected from the area other than the light applied area from the intensity of the microwaves reflected from the light applied area to thereby obtain a differential signal, and determining the gettering property of the gettering layer according to the intensity of the differential signal obtained above.
First claim
Opening claim text (preview).
What is claimed is: 1. A workpiece evaluating method for evaluating the gettering property of a workpiece having a plurality of devices formed on a front side of said workpiece and having a gettering layer formed inside said workpiece, said workpiece evaluating method comprising: an excitation light applying step of applying excitation light for exciting a carrier in said workpiece; a microwave applying step of applying microwaves to a light applied area where said excitation light is applied and also to an area other than said light applied area on said workpiece, after performing said excitation light applying step; a measuring step of measuring the intensity of said microwaves reflected from said light applied area and from the area other than said light applied area after performing said microwave applying step, and next subtracting the intensity of said microwaves reflected from the area other than said light applied area from the intensity of said microwaves reflected from said light applied area to thereby obtain a differential signal; and a gettering property determining step of determining the gettering property of said gettering layer according to the intensity of said differential signal obtained in said measuring step. 2. The workpiece evaluating method according to claim 1 , wherein the frequency of said microwaves is 26 GHz. 3. The workpiece evaluating method according to claim 1 , wherein the wavelength of said excitation light is 349 nm.
Assignees
Inventors
Classifications
within silicon bodies · CPC title
- H10P74/207Primary
Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title
Investigating the presence of flaws · CPC title
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10157802B2 cover?
- A workpiece evaluating method evaluates the gettering property of a device wafer having a plurality of devices formed on the front side of the wafer and having a gettering layer formed inside the wafer. The method includes the steps of applying excitation light for exciting a carrier to the wafer, applying microwaves to a light applied area where the excitation light is applied and also to an a…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P74/207. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).