Polishing apparatus

US9975213B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9975213-B2
Application numberUS-201414508392-A
CountryUS
Kind codeB2
Filing dateOct 7, 2014
Priority dateOct 12, 2013
Publication dateMay 22, 2018
Grant dateMay 22, 2018

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polishing apparatus connected to a robot arm and used to polish a workpiece includes a bracket, a polishing assembly, and a positioning assembly. The polishing assembly is mounted on the bracket and includes a driver and a polishing plate connected to the driver. The driver is capable of driving the polishing plate to rotate, and defines an annular positioning groove around the spin axis. The positioning assembly includes a first positioning plate and a second positioning plate mounted on the bracket and opposite to the first positioning plate. The first positioning plate and the second positioning plate are clamped into two sides of the positioning groove, whereby the driver is clamped between the first positioning plate and the second positioning plate.

First claim

Opening claim text (preview).

What is claimed is: 1. A polishing apparatus connected to a robot arm and used to polish a work piece, the polishing apparatus comprising: a bracket comprising: a connecting plate; a first side plate comprising a first main body and a first assembly portion perpendicularly extending from the first main body; and a second side plate comprising a second main body and a second assembly portion perpendicularly extending from the second main body, the first side plate and the second side plate being mounted on two ends of the connecting plate; a polishing assembly mounted on the bracket, the polishing assembly comprising: a driver; and a polishing plate connected to the driver; the driver having an annular positioning groove on a periphery thereof, the positioning groove having two sides, the driver configured to drive the polishing plate to rotate; a positioning assembly comprising: a first positioning plate mounted on the bracket; and a second positioning plate mounted on the bracket opposite the first positioning plate; and a suction assembly comprising: a supporting member; and a plurality of suction members mounted on the supporting member; the supporting member mounted on the bracket and substantially perpendicular to the polishing assembly; the plurality of suction members mounted at one side of the supportive member away from the bracket; wherein the first positioning plate is clamped into one of the two sides of the positioning groove, and the second positioning plate is clamped into the other one of the two sides of the positioning groove, whereby the driver is clamped between the first positioning plate and the second positioning plate; and wherein the first main body and the second main body are substantially parallel to each other, and the first assembly portion and the second assembly portion are distanced from each other and cooperatively form a receiving space. 2. The polishing apparatus of claim 1 , wherein the first positioning plate is mounted on the first assembly portion, the second positioning plate is mounted on the second assembly portion, and the driver is received in the receiving space. 3. The polishing apparatus of claim 1 , wherein the positioning assembly further comprises a spacing plate mounted between the first main body and the second main body; the spacing plate is substantially parallel to the first positioning plate and the second positioning plate, and one end of the driver is resisted against the spacing plate. 4. The polishing apparatus of claim 3 , wherein, the first positioning plate comprises a first main portion; one end of the first main portion is mounted on the first assembly portion, and the other end of the first main portion defines a first groove; the second positioning plate comprises a second main portion; one end of the second main portion is mounted on the second assembly portion, and the other end of the second main portion defines a second groove; the first groove and the second groove are communicated to the receiving space and cooperatively define a positioning hole; the driver is received in the positioning hole, and the first main portion and the second main portion are clamped into two sides of the positioning hole. 5. The polishing apparatus of claim 4 , wherein the first positioning plate further comprises a first connecting portion extending from the first main portion, and the second positioning plate further comprises a second connecting portion extending from the second main portion; the positioning assembly further comprises a connecting member passing through the first connecting portion and the second portion. 6. The polishing apparatus of claim 1 , wherein the polishing assembly further comprises an air knife used to blow-dry the surface of the workpiece, and the air knife is mounted on the bracket and substantially perpendicular to the polishing assembly. 7. The polishing apparatus of claim 1 , wherein the polishing assembly is an air die grinder. 8. A polishing apparatus connected to a robot arm and used to polish a work piece, the polishing apparatus comprising: a bracket; a polishing assembly mounted on the bracket, the polishing assembly comprising: a driver; and a polishing plate connected to the driver; the driver having an annular positioning groove on a periphery thereof, the positioning groove having two sides, the driver configured to drive the polishing plate to rotate; a positioning assembly comprising: a first positioning plate mounted on the bracket; a second positioning plate mounted on the bracket opposite the first positioning plate, and a spacing plate mounted between the first positioning plate and the second positioning plate, the spacing plate being substantially parallel to the first positioning plate and the second positioning plate; and a suction assembly comprising: a supporting comprising; a plurality of suction members mounted on the supporting member; the supporting member mounted on the bracket and substantially perpendicular to the polishing assembly; the plurality of suction members mounted at one side of the supporting member away from the bracket; wherein one end of the driver is resisted against the spacing plate, the first positioning plate is clamped into one of the two sides of the positioning groove, and the second positioning plate is clamped into the other one of the two sides of the positioning groove, whereby the driver is clamped between the first positioning plate and the second positioning plate. 9. The polishing apparatus of claim 8 , wherein the bracket comprises a connecting plate, a first side plate, and a second side plate; the first side plate and the second side plate are mounted on two ends of the connecting plate. 10. The polishing apparatus of claim 9 , wherein, the first side plate includes a first main body and a first assembly portion perpendicularly extending from the first main body; the second side plate includes a second main body and a second assembly portion perpendicularly extending from the second main body; the first main body and the second main body are substantially parallel to each other, and the first assembly portion and the second assembly portion are distanced from each other and cooperatively form a receiving space. 11. The polishing apparatus of claim 10 , wherein the first positioning plate is mounted on the first assembly portion, the second positioning plate is mounted on the second assembly portion, and the driver is received in the receiving space. 12. The polishing apparatus of claim 8 , wherein, the first positioning plate comprises a first main portion; one end of the first main portion is mounted on the first assembly portion, and the other end of the first main portion defines a first groove; the second positioning plate comprises a second main portion; one end of the second main portion is mounted on the second assembly portion, and the other end of the second main portion defines a second groove; the first groove and the second groove are communicated to the receiving space and cooperatively define a positioning hole; the driver is received in the positioning hole, and the first main portion and the second main portion are clamped into two sides of the positioning hole. 13. The polishing apparatus of claim 12 , wherein the first positioning plate further comprises a first connecting portion extending from the first main portion, and the second positioning plate further comprises a second connecting portion extending from the second main portion; the positioning assembly further comprises a connecting member passing through the first connectin

Assignees

Inventors

Classifications

  • B24B41/005Primary

    Feeding or manipulating devices specially adapted to grinding machines (feeding, loading or unloading work specially adapted to lapping machines B24B37/345) · CPC title

  • Hanging grinding machines · CPC title

  • with vacuum · CPC title

  • Polishing or grinding · CPC title

  • Component parts such as frames, beds, carriages, headstocks · CPC title

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What does patent US9975213B2 cover?
A polishing apparatus connected to a robot arm and used to polish a workpiece includes a bracket, a polishing assembly, and a positioning assembly. The polishing assembly is mounted on the bracket and includes a driver and a polishing plate connected to the driver. The driver is capable of driving the polishing plate to rotate, and defines an annular positioning groove around the spin axis. The…
Who is the assignee on this patent?
Fu Ding Electronical Tech Jiashan Co Ltd, Hon Hai Prec Ind Co Ltd, Fu Ding Electronical Tech Jiashan
What technology area does this patent fall under?
Primary CPC classification B24B41/005. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 22 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).