Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof
US-2025326089-A1 · Oct 23, 2025 · US
characterised by the composition or properties of the plate materials
characterised by the composition or properties of the plate materials · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B37/14 |
| Official title | characterised by the composition or properties of the plate materials |
| Display label | characterised by the composition or properties of the plate materials |
| Total patents | 49 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 3 |
| 2018 | 5 |
| 2019 | 5 |
| 2020 | 7 |
| 2021 | 5 |
| 2022 | 5 |
| 2023 | 4 |
| 2024 | 9 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Disc Grinding for Semiconductor Wafers on Polishing System
US-2025282021-A1 · Sep 11, 2025 · US
Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof
US-12370649-B2 · Jul 29, 2025 · US
Substrate transporter and substrate processing apparatus including substrate transporter
US-12237194-B2 · Feb 25, 2025 · US
Wafer polishing head, method for manufacturing wafer polishing head, and wafer polishing apparatus comprising same
US-12134162-B2 · Nov 5, 2024 · US
Substrate processing control system, substrate processing control method, and program
US-2024316720-A1 · Sep 26, 2024 · US
Substrate processing control system, substrate processing control method, and program
US-12036634-B2 · Jul 16, 2024 · US
Chemical mechanical polishing apparatus and method of replacing polishing pad using the same
US-2024217057-A1 · Jul 4, 2024 · US
Polishing system with platen for substrate edge control
US-2024100646-A1 · Mar 28, 2024 · US
Polishing apparatus and polishing method
US-2024091900-A1 · Mar 21, 2024 · US
Planarization methods for packaging substrates
US-11931855-B2 · Mar 19, 2024 · US
Grinding disc and substrate cleaning device
US-2024042572-A1 · Feb 8, 2024 · US
Polishing system with platen for substrate edge control
US-11890717-B2 · Feb 6, 2024 · US
Composite abrasive, method of preparing same, polishing slurry including same, and method of manufacturing semiconductor device
US-2023357616-A1 · Nov 9, 2023 · US
Double-sided pad conditioner
US-2023114941-A1 · Apr 13, 2023 · US
Pad conditioner with polymer backing plate
US-2023094483-A1 · Mar 30, 2023 · US
Fluorinated polyurea copolymer pad
US-2023082181-A1 · Mar 16, 2023 · US
Wafer polishing head, method for manufacturing wafer polishing head, and wafer polishing apparatus comprising same
US-2022379429-A1 · Dec 1, 2022 · US
Multiple polishing heads with cross-zone pressure element distributions for cmp
US-2022362903-A1 · Nov 17, 2022 · US
Double-side polishing method
US-2022168865-A1 · Jun 2, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B37/14?
- CPC B24B37/14 is the Cooperative Patent Classification code for “characterised by the composition or properties of the plate materials.”
- How many patents are filed under CPC B24B37/14 (characterised by the composition or properties of the plate materials)?
- Our database includes 49 publications tagged with this CPC code.
- Is patent activity under CPC B24B37/14 growing?
- Publication counts under this code: 9 in 2024 vs 4 in 2025 (latest complete years).