Substrate transporter and substrate processing apparatus including substrate transporter

Patent metadata

Field	Value
Publication number	US-12237194-B2
Application number	US-201917258916-A
Country	US
Kind code	B2
Filing date	Jul 9, 2019
Priority date	Jul 12, 2018
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

First claim

The invention claimed is:

1. A substrate conveying apparatus for conveying a rectangular substrate, the substrate conveying apparatus comprising:
a plurality of conveyance rollers configured to support a lower surface of the substrate;
a plurality of roller shafts to which the plurality of conveyance rollers are mounted;
a motor configured to rotate the plurality of roller shafts; and
a pusher for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers, wherein
the pusher includes a stage configured to pass through a clearance between the plurality of roller shafts,
the pusher is configured to be able to hand over the rectangular substrate to a top ring,
the stage of the pusher includes a plurality of support pillars, and
the plurality of support pillars includes four support pillars, one of each of the four support pillars located at one of four corners of the pusher, and each of the four support pillars includes a support surface for supporting the top ring and an inclined surface for guiding the top ring.

2. The substrate conveying apparatus according to claim 1 , comprising
a supporting member disposed between the plurality of conveyance rollers.

3. The substrate conveying apparatus according to claim 1 , comprising
a plurality of guide rollers configured to support the substrate in a width direction perpendicular to a conveying direction of the substrate.

4. The substrate conveying apparatus according to claim 1 , wherein
the substrate has a non-pattern area not used as a device, and
the plurality of conveyance rollers are arranged to be contactable with the non-pattern area in the substrate.

5. The substrate conveying apparatus according to claim 1 , wherein
at least a part of the plurality of conveyance rollers are made of a conductive polymer.

6. The substrate conveying apparatus according to claim 1 , further comprising
a magnet gear, wherein
the motor is configured to rotate the roller shafts via the magnet gear.

7. The substrate conveying apparatus according to claim 1 , further comprising
a stopper configured to enter a conveyance path of the substrate conveyed on the plurality of conveyance rollers, and to contact the substrate during the conveyance.

8. The substrate conveying apparatus according to claim 1 , further comprising
a sensor for sensing presence or absence of the substrate at a predetermined position on the plurality of conveyance rollers.

9. The substrate conveying apparatus according to claim 1 , further comprising
a plurality of support rollers configured to support a top surface of the substrate conveyed by the plurality of conveyance rollers.

10. The substrate conveying apparatus according to claim 1 , wherein
the motor configured to rotate the plurality of roller shafts is a servomotor.

11. The substrate conveying apparatus according to claim 1 , wherein
the pusher includes an elevating mechanism configured to move up and down the stage in an up-down direction, the elevating mechanism is configured to move the stage between an upper position as a position where the stage moves up and a lower position as a position where the stage moves down, and the elevating mechanism is configured such that when the stage moves from the lower position to the upper position, at least a part of the plurality of support pillars of the stage pass through a clearance between the plurality of roller shafts to receive the substrate on the plurality of conveyance rollers by the plurality of support pillars.

12. The substrate conveying apparatus according to claim 1 , wherein
the pusher includes a linear movement mechanism configured to linearly move the stage in a horizontal surface.

13. The substrate conveying apparatus according to claim 1 , wherein
the pusher includes a rotation movement mechanism configured to rotatably move the stage in a horizontal surface.

14. The substrate conveying apparatus according to claim 12 , wherein
the pusher includes a linear motion prevention mechanism configured to prevent the linear motion of the stage.

15. The substrate conveying apparatus according to claim 13 , wherein
the pusher includes a rotational motion prevention mechanism configured to prevent the rotational motion of the stage.

16. A substrate processing apparatus comprising:
a polishing unit for polishing a substrate;
a cleaning unit for cleaning the substrate;
a drying unit for drying the substrate; and
a conveying unit configured to convey the substrate between the polishing unit, the cleaning unit, and the drying unit, wherein
the conveying unit includes the substrate conveying apparatus according to claim 1 .

17. The substrate processing apparatus according to claim 16 , wherein
the polishing unit includes:
a table for holding a polishing pad;
a table driving mechanism configured to rotatably drive the table;
a top ring for holding the substrate; and
a pressing mechanism for pressing the substrate held to the top ring against the polishing pad held on the table, wherein

the top ring is configured to receive the substrate from the stage of the pusher and hand over the substrate held by the top ring to the stage of the pusher.

18. The substrate processing apparatus according to claim 17 , wherein
the polishing unit includes a polishing liquid supply mechanism for supplying a polishing liquid on the polishing pad on the table.

19. The substrate processing apparatus according to claim 18 , wherein
the polishing liquid supply mechanism includes a flow passage disposed in the table, and the flow passage communicates with opening portions defined in a surface of the table and the polishing pad.

20. The substrate processing apparatus according to claim 17 , wherein
the top ring includes an air bag, and a pressure of a fluid supplied into the air bag makes a pressing force of the substrate against the polishing pad controllable.

21. The substrate processing apparatus according to claim 17 , wherein
the table has a surface including a silicone layer or a fluorine-based resin layer for facilitating separation of the polishing pad from the table.

22. The substrate processing apparatus according to claim 17 , wherein
the substrate processing apparatus includes the polishing pad held on the table, and
the polishing pad has a surface having a groove communicating with an outer periphery of the polishing pad and a groove not communicating with the outer periphery of the polishing pad.

23. The substrate processing apparatus according to claim 22 , wherein
the grooves of the polishing pad include grooves defining a concentric pattern and grooves defining a radial pattern.

24. The substrate processing apparatus according to claim 22 , wherein
the grooves of the polishing pad include grooves defining a grid pattern.

25. The substrate processing apparatus according to claim 16 , wherein
the cleaning unit includes a cleaning nozzle for supplying a cleaning liquid to the substrate on the conveyance rollers.

26. The substrate processing apparatus according to claim 25 , wherein
the cleaning nozzles are disposed on both of a top surface side and a lower surface side viewed from the substrate on the conveyance rollers.

27. The substrate processing apparatus according to claim 16 , wherein
the drying unit include

Assignees

• Ebara Corp

Inventors

• Yazawa Akihiro
• Koba Takashi
• Kobayashi Kenichi
• Akazawa Kenichi
• Du Fong-Jie
• Kashiwagi Makoto
• MATSUGU Asagi
• Nanjo Takahiro
• Aoyama Hideharu
• Mitsuya Takashi
• Togawa Tetsuji

Classifications

• H10P72/3314

  Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/0408

  for drying · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title