Abrasive element precursor with precisely shaped features and methods of making thereof
US-9956664-B2 · May 1, 2018 · US
US12370649B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12370649-B2 |
| Application number | US-202017430774-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 11, 2020 |
| Priority date | Feb 13, 2019 |
| Publication date | Jul 29, 2025 |
| Grant date | Jul 29, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An abrasive article includes a plurality of abrasive features disposed on one or more abrasive elements. Each of the one or more abrasive elements includes a base having a first major surface from which the plurality of abrasive features extends. A first set of the plurality of abrasive features (i) has an average height, H 1avg , (ii) a standard deviation of less than 10% of H 1avg , and (iii) comprises between 5 and 130 abrasive features.
Opening claim text (preview).
What is claimed is: 1. An abrasive article comprising: a plurality of abrasive features disposed on one or more abrasive elements, each of the one or more abrasive elements comprising a base having a first major surface from which the plurality of abrasive features extend; wherein a first set of the plurality of abrasive features (i) has an average height, H 1avg , (ii) has a standard deviation of less than 10% of H 1avg , and (iii) comprises between 5 and 130 abrasive features; wherein a second set of the plurality of abrasive features has (i) an average height, H 2avg , and (ii) a standard deviation of less than 10% of H 2avg , wherein H 1ave is at least 5 microns greater than H 2avg ; wherein cross sectional areas of each of the plurality of features of the second set of plurality of abrasive features (i) taken in a plane that is parallel to the first major surface of the bases, and (ii) at a position along the second set of abrasive features that is 50% or less of the H 2avg , cumulatively, is at least 5% of the cumulative projected areas of the of the one or more abrasive elements. 2. The abrasive article of claim 1 , wherein the second set of the plurality of abrasive features comprises at least 100 abrasive features. 3. The abrasive article of claim 1 , the plurality of abrasive features of the first set of plurality of abrasive features and their respective abrasive element bases, as a collective, are monolithic. 4. The abrasive article of claim 1 , wherein the first set of plurality of abrasive features are precisely shaped features. 5. The abrasive article of claim 1 , wherein an areal density of the first set of plurality of abrasive features is between 0.01 to 0.30/cm 2 . 6. The abrasive article of claim 1 , wherein an areal density of the second set of plurality of abrasive features is between 0.2 to 33.0/cm 2 . 7. The abrasive article of claim 1 , wherein the one or more abrasive elements comprise a carbide ceramic. 8. The abrasive article of claim 7 , wherein carbide ceramic is silicon carbide, boron carbide, zirconium carbide, titanium carbide, tungsten carbide or combinations thereof. 9. The abrasive article of claim 1 , wherein the one or more abrasive elements are at least 99% by weight silicon carbide, based on the total weight of the base and the plurality of abrasive features. 10. The abrasive article of claim 1 , wherein a porosity of the abrasive elements is less than 3%. 11. The abrasive article of claim 1 , further comprising a chemical vapor deposited or physical vapor deposited coating disposed on the plurality of abrasive features. 12. The abrasive article of claim 1 , further comprising a carrier plate having a first major surface; wherein the one or more abrasive elements are coupled to the first major surface of the carrier plate. 13. A method of conditioning a polishing pad, the method comprising: performing a CMP operation using a polishing pad; and contacting a working surface of the polishing pad with a working surface of the abrasive article of claim 1 .
of semiconductor materials · CPC title
Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title
characterised by the shape of the lapping pad surface, e.g. grooved · CPC title
characterised by the composition or properties of the plate materials · CPC title
Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.