Wafer polishing head, method for manufacturing wafer polishing head, and wafer polishing apparatus comprising same

Patent metadata

Field	Value
Publication number	US-12134162-B2
Application number	US-201917765899-A
Country	US
Kind code	B2
Filing date	Oct 23, 2019
Priority date	Oct 1, 2019
Publication date	Nov 5, 2024
Grant date	Nov 5, 2024

Abstract

The present invention provides a method for manufacturing a wafer polishing head, the method comprising the steps of: coupling a guide ring consisting of a plurality of layers to the edge of a base substrate; rounding the edge of the guide ring; forming a first coating layer on the rounded surface of the guide ring through coating; fixing a rubber chuck to the base substrate; and forming a second coating layer on the outer circumferential surfaces of an adhesive and an adhesive material through coating, from the rubber chuck to the first coating layer.

First claim

The invention claimed is:

1. A wafer polishing head, comprising:
a template assembly comprising a base substrate, a guide ring disposed at an edge of the base substrate, an adhesive material configured to adhere the guide ring and the base substrate to each other, a round surface formed on an outer side surface of the guide ring, and an adhesive applied to one surface of the base substrate;
a first coating layer formed on the round surface;
a rubber chuck configured to fix the base substrate and to support the template assembly; and
a second coating layer formed on the adhesive and an outer circumferential surface of the guide ring, wherein the first coating layer has a thickness of 2 mm to 5 mm, and the width of the first coating layer is greater than the width of the rounded portion of the guide ring.

2. The wafer polishing head according to claim 1 , wherein each of the first and second coating layers is an epoxy coating layer.

3. The wafer polishing head according to claim 1 , wherein each of the first and second coating layers comprises epoxy and a polymer mixed at a mass ratio of 2:1 to 4:1.

4. The wafer polishing head according to claim 1 , wherein the second coating layer has a thickness equal to or less than a thickness of the first coating layer.

5. The wafer polishing head according to claim 4 , wherein the second coating layer has a thickness of 1 mm to 5 mm.

6. The wafer polishing head according to claim 1 , wherein the second coating layer has a length from the rubber chuck to the first coating layer.

7. A wafer polishing apparatus comprising:
the wafer polishing head according to claim 1 ; and
a polishing table having a polishing pad attached thereto, the polishing table being disposed under the wafer polishing head.

8. The wafer polishing apparatus according to claim 7 , wherein an edge part of the rubber chuck is thinner than a central part of the rubber chuck.

9. The wafer polishing apparatus according to claim 7 , wherein each of the first and second coating layers is an epoxy coating layer.

10. The wafer polishing apparatus according to claim 7 , wherein the second coating layer has a thickness equal to or less than a thickness of the first coating layer.

11. The wafer polishing head according to claim 1 , wherein an edge part of the rubber chuck is thinner than a central part of the rubber chuck.

12. A wafer polishing head manufacturing method, comprising:
coupling a guide ring constituted by a plurality of layers to an edge of a base substrate;
rounding an edge of the guide ring;
forming a first coating layer on a rounded edge of the guide ring;
fixing the base substrate and a rubber chuck to each other; and
forming a second coating layer on an adhesive and an outer circumferential surface of the guide ring from the rubber chuck to the first coating layer, wherein the first coating layer has a thickness of 2 mm to 5 mm, and the width of the first coating layer is greater than the width of the rounded portion of the guide ring.

13. The wafer polishing head manufacturing method according to claim 12 , wherein the second coating layer is formed by applying and drying a material comprising epoxy and a polymer mixed at a ratio of 2:1 to 4:1.

14. The wafer polishing head manufacturing method according to claim 13 , wherein the drying comprises primary drying performed at a temperature of 45° C. or higher and secondary drying performed at room temperature.

15. The wafer polishing head manufacturing method according to claim 12 , wherein the second coating layer is formed by applying a material comprising epoxy and a polymer so as to have a thickness of 1 mm to 5 mm.

16. The wafer polishing head manufacturing method according to claim 12 , wherein an edge part of the rubber chuck is thinner than a central part of the rubber chuck.

Assignees

• Sk Siltron Co Ltd

Inventors

• Sung Jae Chel

Classifications

• B24D3/28

  Resins {or natural or synthetic macromolecular compounds (B24D3/22 takes precedence)} · CPC title

• B24D3/004

  with special coatings · CPC title

• B24B37/32 Primary

  Retaining rings · CPC title

• B24D3/22

  Rubbers {synthetic or natural} · CPC title

• B24B37/20 Primary

  Lapping pads for working plane surfaces · CPC title