Substrate handling systems and methods for CMP processing
US-12454036-B2 · Oct 28, 2025 · US
the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B37/102 |
| Official title | {the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool} |
| Display label | the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool |
| Total patents | 25 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2016 | 1 |
| 2018 | 1 |
| 2020 | 1 |
| 2021 | 2 |
| 2022 | 6 |
| 2023 | 6 |
| 2024 | 4 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate processing apparatus and method of processing substrate using the same
US-2025214198-A1 · Jul 3, 2025 · US
Substrate polishing apparatus and substrate polishing method
US-12318881-B2 · Jun 3, 2025 · US
Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer
US-12285840-B2 · Apr 29, 2025 · US
Systems and methods to detect rotation of a vibratory polisher
US-2024189958-A1 · Jun 13, 2024 · US
Wafer manufacturing method and wafer
US-11969856-B2 · Apr 30, 2024 · US
Polishing unit, substrate processing apparatus, and polishing method
US-11890716-B2 · Feb 6, 2024 · US
Polishing pad conditioning system and method of using
US-2024009801-A1 · Jan 11, 2024 · US
Chemical mechanical polishing system and method of using
US-11724360-B2 · Aug 15, 2023 · US
Substrate cleaning device and substrate polishing device
US-2023182262-A1 · Jun 15, 2023 · US
Polishing apparatus and polishing method
US-2023158636-A1 · May 25, 2023 · US
Cmp process applied to a thin sic wafer for stress release and damage recovery
US-2023128739-A1 · Apr 27, 2023 · US
Temperature control of chemical mechanical polishing
US-11597052-B2 · Mar 7, 2023 · US
Temperature control of chemical mechanical polishing
US-2023029290-A1 · Jan 26, 2023 · US
Substrate polishing apparatus and substrate polishing method
US-2022305610-A1 · Sep 29, 2022 · US
Metallographic grinder and components thereof
US-11397139-B2 · Jul 26, 2022 · US
Offset head-spindle for chemical mechanical polishing
US-11389925-B2 · Jul 19, 2022 · US
Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer
US-2022161388-A1 · May 26, 2022 · US
Wafer manufacturing method and wafer
US-2022097200-A1 · Mar 31, 2022 · US
Substrate handling systems and methods for cmp processing
US-2022072682-A1 · Mar 10, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B37/102?
- CPC B24B37/102 is the Cooperative Patent Classification code for “the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool.”
- How many patents are filed under CPC B24B37/102 (the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool)?
- Our database includes 25 publications tagged with this CPC code.
- Is patent activity under CPC B24B37/102 growing?
- Publication counts under this code: 4 in 2024 vs 4 in 2025 (latest complete years).