Polishing unit, substrate processing apparatus, and polishing method

Patent metadata

Field	Value
Publication number	US-11890716-B2
Application number	US-202017117723-A
Country	US
Kind code	B2
Filing date	Dec 10, 2020
Priority date	Dec 24, 2019
Publication date	Feb 6, 2024
Grant date	Feb 6, 2024

Abstract

An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350 , a top ring 302 , a light emitting member 371 , a slip-out detector 370 , and an elimination mechanism 380 . A polishing pad 352 that polishes a substrate WF is attached to the polishing table 350 . The top ring 302 holds the substrate WF to press the substrate WF against the polishing pad 352 . The light emitting member 371 emits a light to a detection area 372 on the polishing pad 352 . The slip-out detector 370 detects a slip out of the substrate WF from the top ring 302 based on the light reflected from the detection area 372 . The elimination mechanism 380 eliminates a polishing liquid flowing into the detection area 372.

First claim

What is claimed is:

1. A polishing unit comprising:
a rotatable polishing table to which a polishing pad for polishing a substrate is attached;
a top ring configured to hold the substrate to press the substrate against the polishing pad;
a slip-out detector comprising:
a light source configured to emit a light to a detection area on the polishing pad; and
a light detector configured to detect the light reflected from the detection area;

the slip-out detector configured to detect a slip out of the substrate from the top ring based on the light reflected from the detection area; and
an elimination mechanism configured to eliminate a polishing liquid flowing into the detection area, the elimination mechanism located at an upstream side of the light detector in a direction of rotation of the polishing table,
wherein the slip-out detector is configured to detect the slip out of the substrate from the top ring based on a difference between a reference color and a color of light reflected from the detection area of the polishing pad during a polishing process,
wherein the polishing unit is configured to count a cumulative number of polishing processes of the substrate,
wherein the polishing unit is configured to reset the reference color of the slip-out detector and automatically register the reference color based on the light reflected from the detection area when the counted cumulative number of polishing processes exceeds a threshold value, and
wherein the slip-out detector is configured to detect the slip out of the substrate from the top ring based on a difference between the registered reference color and the color of light reflected from the detection area of the polishing pad during the polishing process.

2. The polishing unit according to claim 1 , wherein
the slip-out detector is configured to detect the slip out of the substrate from the top ring based on a change of an amount of the light reflected from the detection area in addition to the difference between the reference color or the registered reference color and the color of the light reflected from the detection area of the polishing pad during the polishing process.

3. The polishing unit according to claim 1 , wherein
the elimination mechanism includes a purge mechanism for spraying a fluid to the detection area to eliminate the polishing liquid flowing into the detection area.

4. The polishing unit according to claim 1 , wherein
the elimination mechanism includes a suction mechanism for suctioning the polishing liquid flowing into the detection area to eliminate the polishing liquid flowing into the detection area.

5. The polishing unit according to claim 1 , wherein
the light source, the light detector, and the elimination mechanism are disposed to each of a plurality of detection areas on the polishing pad.

6. The polishing unit according to claim 1 , wherein
the light source, the light detector, and the elimination mechanism are mounted to the top ring.

7. A substrate processing apparatus comprising:
the polishing unit for polishing the substrate according to claim 1 ;
a conveyance unit for conveying the substrate; and
a drying unit for drying the substrate.

8. A polishing method comprising:
rotating a polishing table to which a polishing pad is attached;
polishing a substrate by flowing a polishing liquid on the polishing pad that polishes the substrate held by a top ring;
detecting a slip out of the substrate from the top ring by emitting a light to a detection area on the polishing pad and receiving the light reflected from the detection area; and
eliminating the polishing liquid flowing into the detection area from an upstream side of the detection area in a direction of rotation of the polishing table,
wherein detecting the slip out of the substrate includes detecting the slip out of the substrate from the top ring based on a difference between a reference color and a color of the light reflected from the detection area of the polishing pad during a polishing process,
wherein detecting the slip out of the substrate further includes:
counting a cumulative number of polishing processes of the substrate;
resetting the reference color by automatically registering the reference color based on the light reflected from the detection area of the polishing pad when the counted cumulative number of polishing processes exceeds a threshold value; and
detecting the slip out of the substrate from the top ring based on a difference between the registered reference color and the color of the light reflected from the detection area of the polishing pad during the polishing process.

Assignees

• Ebara Corp

Inventors

• Yazawa Akihiro
• Kobayashi Kenichi
• MATSUGU Asagi

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B37/0053 Primary

  detecting loss or breakage of a workpiece during lapping · CPC title

• B24B37/04

  designed for working plane surfaces · CPC title

• B24B49/12

  involving optical means · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title