Polymer via plugs with high thermal integrity
US-10020244-B2 · Jul 10, 2018 · US
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Hagleitner Helmut patents
Hagleitner Helmut holds 7 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 7 |
| Recent patents | 0 |
| First publication | Sep 22, 2015 |
| Latest publication | Jul 10, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Schottky contact
US-9640627-B2 · May 2, 2017 · US
Contact pad
US-9607955-B2 · Mar 28, 2017 · US
Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features
US-9548206-B2 · Jan 17, 2017 · US
Method of forming vias in silicon carbide and resulting devices and circuits
US-9490169-B2 · Nov 8, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Polymer via plugs with high thermal integrity
US-10020244-B2 · Jul 10, 2018 · US
Schottky contact
US-9640627-B2 · May 2, 2017 · US
Contact pad
US-9607955-B2 · Mar 28, 2017 · US
Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features
US-9548206-B2 · Jan 17, 2017 · US
Method of forming vias in silicon carbide and resulting devices and circuits
US-9490169-B2 · Nov 8, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10D62/8503 | 5 |
| H10D62/85 | 5 |
| H01L29/2003 | 5 |
| H10D30/4755 | 4 |
| H01L29/7787 | 4 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 7 |