SOI wafer, manufacturing method therefor, and MEMS device
US-9266715-B2 · Feb 23, 2016 · US
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Ichikawa Jyunichi patents
Ichikawa Jyunichi holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Dec 15, 2015 |
| Latest publication | Feb 23, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
SOI wafer, manufacturing method therefor, and MEMS device
US-9212049-B2 · Dec 15, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
SOI wafer, manufacturing method therefor, and MEMS device
US-9266715-B2 · Feb 23, 2016 · US
SOI wafer, manufacturing method therefor, and MEMS device
US-9212049-B2 · Dec 15, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W10/181 | 2 |
| H10P90/1924 | 2 |
| H10W76/48 | 2 |
| H10D62/83 | 2 |
| B81B7/0038 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 2 |
| Electricity | 2 |