Piezoelectric microelectromechanical resonator device and corresponding manufacturing process
US-2024154599-A1 · May 9, 2024 · US
using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81B7/0038 |
| Official title | {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters} |
| Display label | using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters |
| Total patents | 431 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 55 |
| 2016 | 51 |
| 2017 | 61 |
| 2018 | 51 |
| 2019 | 42 |
| 2020 | 40 |
| 2021 | 22 |
| 2022 | 24 |
| 2023 | 26 |
| 2024 | 26 |
| 2025 | 27 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Apparatus and Method For Protecting a Micro-Electro-Mechanical System
US-2016376144-A1 · Dec 29, 2016 · US
Encapsulation structure including a mechanically reinforced cap and with a getter effect
US-9511991-B2 · Dec 6, 2016 · US
Integrated circuit package with sensor and method of making
US-2016347607-A1 · Dec 1, 2016 · US
High Vacuum Sealing for Sensor Platform Process
US-2016060103-A1 · Mar 3, 2016 · US
Mems package structure and method for fabricating the same
US-2015375993-A1 · Dec 31, 2015 · US
Micromechanical component and method for manufacturing same
US-2015360937-A1 · Dec 17, 2015 · US
SOI wafer, manufacturing method therefor, and MEMS device
US-9212049-B2 · Dec 15, 2015 · US
Systems and methods for forming MEMS assemblies incorporating getters
US-9212051-B1 · Dec 15, 2015 · US
Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component
US-2015353346-A1 · Dec 10, 2015 · US
Electronic component and manufacturing method of the same
US-2015344298-A1 · Dec 3, 2015 · US
Method of limiting capillary action of gel material during assembly of pressure sensor
US-9190339-B2 · Nov 17, 2015 · US
Electrical component and method of manufacturing the same
US-9181081-B2 · Nov 10, 2015 · US
Mems device and method of forming the same
US-2015307348-A1 · Oct 29, 2015 · US
Systems and methods for a three-layer chip-scale MEMS device
US-9171964-B2 · Oct 27, 2015 · US
MEMS device and method of forming the same
US-9169117-B1 · Oct 27, 2015 · US
Hermetic plastic molded mems device package and method of fabrication
US-2015303121-A1 · Oct 22, 2015 · US
Mems device and method of forming the same
US-2015291416-A1 · Oct 15, 2015 · US
MEMS encapsulation by multilayer film lamination
US-9156678-B2 · Oct 13, 2015 · US
Wafer level package solder barrier used as vacuum getter
US-2015279755-A1 · Oct 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81B7/0038?
- CPC B81B7/0038 is the Cooperative Patent Classification code for “using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters.”
- How many patents are filed under CPC B81B7/0038 (using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters)?
- Our database includes 431 publications tagged with this CPC code.
- Is patent activity under CPC B81B7/0038 growing?
- Publication counts under this code: 26 in 2024 vs 27 in 2025 (latest complete years).