Adhesive composition for semiconductor and adhesive film including the same
US-9957425-B2 · May 1, 2018 · US
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Lee Jun Woo patents
Lee Jun Woo holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | Jul 7, 2015 |
| Latest publication | May 1, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Photoreactive material layer and method of manufacturing the same
US-9348073-B2 · May 24, 2016 · US
Liquid crystal display and method for manufacturing the same
US-9304356-B2 · Apr 5, 2016 · US
Dicing die-bonding film and method of forming a cut on the dicing die-bonding film
US-9287217-B2 · Mar 15, 2016 · US
Location information collection method and system for dual SIM mobile terminals
US-9121921-B2 · Sep 1, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Adhesive composition for semiconductor and adhesive film including the same
US-9957425-B2 · May 1, 2018 · US
Photoreactive material layer and method of manufacturing the same
US-9348073-B2 · May 24, 2016 · US
Liquid crystal display and method for manufacturing the same
US-9304356-B2 · Apr 5, 2016 · US
Dicing die-bonding film and method of forming a cut on the dicing die-bonding film
US-9287217-B2 · Mar 15, 2016 · US
Location information collection method and system for dual SIM mobile terminals
US-9121921-B2 · Sep 1, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10P72/7402 | 2 |
| H10W72/073 | 2 |
| H01L24/27 | 2 |
| C09J2203/326 | 2 |
| H01L2224/83191 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Physics | 4 |
| Chemistry & Metallurgy | 3 |
| Electricity | 3 |
| Operations & Transport | 1 |
| Cross-Sectional Technologies | 1 |